公开(公告)号：JP2002076583A

公开(公告)日：2002-03-15

申请号：JP2000265007

申请日：2000-09-01

Applicant: TORAY INDUSTRIES

Inventor： SHINOHARA HIDEKI ,  KIGOSHI SHOJI ,  UCHIDA TOMOKA

IPC: C09J7/02 ,  C09J109/02 ,  C09J163/00 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To industrially provide a novel coverlay film exhibiting excellent shelf life, adhesion and solder heat resistance without sacrifice of circuit embedding properties. SOLUTION: The coverlay film comprises a laminate of an insulating plastic film layer coated with a thermosetting adhesive layer and a mold releasing film layer wherein the adhesive layer in semicured state satisfies following conditions: (C) heating value in 160 deg.C 60 min constant temperature holding process is 5-22 J/g according to DSC(differential scanning calorimetry), (B) vertex of heating curve is 200 deg.C or above in DSC, and (C) copper foil adhesion is 5 N/cm or above after hot press curing.

公开(公告)号：JP2003229458A

公开(公告)日：2003-08-15

申请号：JP2002025328

申请日：2002-02-01

Applicant: TORAY INDUSTRIES

Inventor： UCHIDA TOMOKA ,  SHINOHARA HIDEKI

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor IC which is capable of retaining an original adhesion for a long time without leaving bubbles when constituent components of the substrate are pasted to each other. SOLUTION: The substrate for a semiconductor IC comprises (A) a wiring board formed of an insulator layer and a conductor pattern, at least one layer of (B) layer not formed with a conductor pattern, and at least one layer of (C) adhesive layer. A method of manufacturing the substrate for a semiconductor IC comprises applying an organic solvent to either a pasting face of (A) the wiring board or a pasting face of the adhesive layer, or both of the pasting faces, and applying the organic solvent to either a pasting face of the (B) layer or another pasting face of the adhesive layer, or both of the pasting faces, and then compressing-bonding the wiring board and these layers, and heating the laminate to volatilize and remove the organic solvent. COPYRIGHT: (C)2003,JPO