公开(公告)号：DE69732004D1

公开(公告)日：2005-01-27

申请号：DE69732004

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：DE69739429D1

公开(公告)日：2009-07-09

申请号：DE69739429

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: H01L21/60 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：AT285623T

公开(公告)日：2005-01-15

申请号：AT97904577

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：DE69732004T2

公开(公告)日：2006-01-19

申请号：DE69732004

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：HK1064803A1

公开(公告)日：2005-02-04

申请号：HK04107533

申请日：2004-09-30

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G20090101 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J20090101 ,  C09J7/02 ,  C09J163/00 ,  H01L20090101 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：AT432531T

公开(公告)日：2009-06-15

申请号：AT04009915

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: H01L21/60 ,  C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：HK1008913A1

公开(公告)日：1999-07-30

申请号：HK98109639

申请日：1998-08-03

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L ,  C08G ,  C09J

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：EP0823729A4

公开(公告)日：2000-05-03

申请号：EP97904577

申请日：1997-02-19

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA YASUSHI ,  KIGOSHI SHOJI ,  HATANO TAKU ,  KONISHI YUKITSUNA ,  ANDO YOSHIO

IPC: C08G59/24 ,  C08L55/00 ,  C08L77/00 ,  C09J7/02 ,  C09J163/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/60

CPC classification number: H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

Abstract translation: 用于连接由具有在上的基材粘合剂层的层压体的基材的半导体用粘接片，worin所述粘合剂层含有热塑性树脂（A）和环氧树脂（B）和所述环氧树脂（B）含有至少一个环氧基 从（I）二环戊二烯骨架的环氧树脂中选择的树脂（B），（II）萜烯骨架的环氧树脂（III）联苯环氧树脂和（IV）的含萘骨架的环氧树脂作为必要成分骨架的; 对于TAB由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层叠的背涂粘合剂的带的worin所述粘合层具有60的软化温度到110℃，在固化后和50小时或更长时间 在绝缘电阻滴加时间已经被允许在130℃和85％RH的环境用DC 100V的应用静置后; 并用粘合剂进行引线接合连接由具有在粘合剂层和在柔性有机绝缘电影的保护膜层，层压的带worin所述粘合层具有120的软化温度至170℃已被固化后，存储 弹性模量E“20至100MPa，在150℃，并在绝缘电阻滴加50小时或更多的时间之后具有被允许在130℃和85％RH的环境中静置以DC 100V的应用。 用于连接衬底的半导体用粘接片，用于TAB的粘合剂背衬带和本发明的引线接合连接的粘合剂背衬带具有优异的粘合强度，insulatability，尺寸精度等，并且可以提高可靠性 一种半导体集成电路分别连接基板和半导体装置的高密度封装。

公开(公告)号：JP2002076583A

公开(公告)日：2002-03-15

申请号：JP2000265007

申请日：2000-09-01

Applicant: TORAY INDUSTRIES

Inventor： SHINOHARA HIDEKI ,  KIGOSHI SHOJI ,  UCHIDA TOMOKA

IPC: C09J7/02 ,  C09J109/02 ,  C09J163/00 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To industrially provide a novel coverlay film exhibiting excellent shelf life, adhesion and solder heat resistance without sacrifice of circuit embedding properties. SOLUTION: The coverlay film comprises a laminate of an insulating plastic film layer coated with a thermosetting adhesive layer and a mold releasing film layer wherein the adhesive layer in semicured state satisfies following conditions: (C) heating value in 160 deg.C 60 min constant temperature holding process is 5-22 J/g according to DSC(differential scanning calorimetry), (B) vertex of heating curve is 200 deg.C or above in DSC, and (C) copper foil adhesion is 5 N/cm or above after hot press curing.

公开(公告)号：JP2001354938A

公开(公告)日：2001-12-25

申请号：JP2000175114

申请日：2000-06-12

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  TSUTSUMI YASUAKI ,  SHINOHARA HIDEKI

IPC: C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/12 ,  H01L21/52 ,  H01L21/60 ,  H01L23/14 ,  H01L23/373 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To obtain an adhesive composition for semiconductors, which, while retaining excellent insulation properties, can achieve excellent adhesiveness, warpage prevention, and temperature cycle endurance, and to prepare an adhesive sheet and to provide a semiconductor device both prepared by using the same. SOLUTION: This adhesive composition contains, as an essential ingredient, a polyesteramide having ester groups in the main chain. Both the adhesive sheet and the semiconductor device are prepared by using the composition.