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    PHOTOMASK
    2.
    发明专利
    PHOTOMASK 失效

    公开(公告)号：JPS5843455A

    公开(公告)日：1983-03-14

    申请号：JP14091881

    申请日：1981-09-09

    Applicant: TORAY INDUSTRIES

    Inventor： YOSHINO TSUNEO

    IPC: G03F1/00 ,  G03F1/56

    Abstract: PURPOSE:To obtain a mask enabling easy vacuum contact by forming a resin film image on a flexible transparent resin film using a solvent development type photosensitive film having basic or acidic groups and by coloring the image with an acidic or basic compound to provide difference in level between the resulting light shielding part and the light transmitting part. CONSTITUTION:A solvent-developable photosensitive film having basic or acidic groups and >=15mum thickness is formed on a flexible transparent resin film of polyethylene terephthalate or the like directly or with an undercoat layer in- between by applying a photosensitive liq. prepared by adding a photopolymn. catalyst to methyl methacrylate and methacrylic acid, dimethylaminoethyl methacrylate or the like. The photosensitive film is imagewise exposed and developed with a solvent to remove the unexposed part. The remaining film is dyed with an acidic or basic compound showing intense absorption in 360-410nm to form a light shielding part. When the film has basic groups, the acidic compound is used. Thus, a photomask having difference in level between the light shielding part and the light transmitting part is obtd. Since the photomask has high work efficiency in vacuum contact, it is suitable for use as a precise photomask for printed wiring.

    METHOD FOR DEVELOPING PHOTOSENSITIVE RESIN FILM
    5.
    发明专利
    METHOD FOR DEVELOPING PHOTOSENSITIVE RESIN FILM 失效

    公开(公告)号：JPS57129437A

    公开(公告)日：1982-08-11

    申请号：JP1441881

    申请日：1981-02-04

    Applicant: TORAY INDUSTRIES

    Inventor： YOSHINO TSUNEO

    IPC: H05K3/06 ,  G03F7/30

    Abstract: PURPOSE:To lessen film break frequency in comparison to a spray method, by vibrating a photosensitive resin film in the direction almost perpendicular to the normal of the film face in a developing solution at high speed. CONSTITUTION:A photosensitive resin film is vibrated at high speed in a developing solution in the direction almost perpendicular to the normal of the film face. Two-dimensional vibration is preferable, but one-dimensional vibration is little disadvantageous. When a motor is used, 100-10,000 times/min frequency is practicable, but 300-5,000 times/min frequency is preferable. Desirable vibration amplitude is below several cm, preferably 0.05-5.0cm.

    PHOTOSENSITIVE RESIN FIXING METHOD
    6.
    发明专利
    PHOTOSENSITIVE RESIN FIXING METHOD 失效

    公开(公告)号：JPS5625734A

    公开(公告)日：1981-03-12

    申请号：JP10124379

    申请日：1979-08-10

    Applicant: TORAY INDUSTRIES

    Inventor： YOSHINO TSUNEO

    IPC: H05K3/06 ,  G03F7/00 ,  G03F7/32 ,  G03F7/40 ,  H01L21/027 ,  H01L21/30

    Abstract: PURPOSE:To form a clear resist pattern without causing air pollution by fixing a photosensitive resin developed with 1,1,1-trichloroethane using a specified fixing soln. CONSTITUTION:A solvent development type photosensitive resin film such as a methyl methacrylate copolymer-base thin film on a substrate is imagewise exposed, developed with 1,1,1-trichloroethane, and fixed with a fixing soln. of a nonpolar nonconjugated compound such as ethylene tetrachloride, octane or fluorocarbon oil. The concn, of trichloroethane in the fixing soln. is gradually increased by repeating fixing, yet little influence is exerted on the power of the fixing soln.

    PHOTOSENSITIVE RESIN FILM AND FORMATION OF RESIST IMAGE USING IT
    8.
    发明专利
    PHOTOSENSITIVE RESIN FILM AND FORMATION OF RESIST IMAGE USING IT 失效

    公开(公告)号：JPS58111027A

    公开(公告)日：1983-07-01

    申请号：JP20816181

    申请日：1981-12-24

    Applicant: TORAY INDUSTRIES

    Inventor： YOSHINO TSUNEO

    IPC: G03F7/26 ,  G03F7/004 ,  G03F7/09 ,  G03F7/11

    Abstract: PURPOSE:To obtain a resist image with high resolution suitable for use in the manufacture of a printed wiring plate by forming a thin polymer film (HC film) contg. a specified nonaromatic hydrocarbon as the principal component on a flexible film and a photosensitive resin film contg. (meth)acrylic ester on the HC film. CONSTITUTION:An HC film contg. a nonaromatic hydrocarbon which is impermeable to (meth) acrylic ester and can be remove with a developr as the principal component is formed on a flexible film such as a polyester film to produce a supporting film. Said hydrocarbon is cyclized rubber, polybutadiene or the like. A photosensitive resin film contg. (meth)acrylic ester is formed on the HC film, or a protective film of polyolefin or the like is further formed. After removing the protective film, the photosensitive resin film is press-bonded to the copper surface of a copper lined laminated plate under heating, and the flexible film is removed. At this time, the HC film is not stripped off because of the high adhesive strength to the photosensitive resin film. A photomask is then brought into vacuum contact with the resin film, and after carrying out exposure, the vacuum state is returned to ordinary pressure. The mask is removed without causing scratch and stain and can be reutilized. The photosensitive film is developed by spraying 1,1,1-trichloroethane as a developer. At the same time, the HC film is removed.

    FORMATION OF RESIST PATTERN
    10.
    发明专利
    FORMATION OF RESIST PATTERN 失效

    公开(公告)号：JPS5638458A

    公开(公告)日：1981-04-13

    申请号：JP11281179

    申请日：1979-09-05

    Applicant: TORAY INDUSTRIES

    Inventor： YOSHINO TSUNEO

    IPC: G03F7/26 ,  G03C5/00 ,  G03F7/085

    Abstract: PURPOSE:To form the resist pattern without causing conventional side etching in a fine metal working using a chemical process by a method wherein a copper surface and a polymer having a group coordinating with copper are either brought into contact or heated via an intermediate object, so that a nonsoluble coating layer is formed on the contact surface. CONSTITUTION:In the fine metal working using the chemical process, the copper surface and the polymer having group coordinating with copper (e.g. polymer of vinyl monomer having nitrile or amino group) are brought into contact (by coating and drying). Alternatively, the copper surface and the polymer are separated by an intermediate object (metal or polymer having no group coordinating with copper) and then heated. In both the processes, a nonsoluble layer is formed on the contact surface. Then, a solvent such as chloroethane is used do dissolve the part of polymer not contacting the copper. If necessary, the intermediate object is dissolved by a proper solvent to form a desired resist film.

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