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    Method of manufacturing insulating resin composition for high-voltage equipment and insulating material for high-voltage equipment
    1.
    发明专利
    Method of manufacturing insulating resin composition for high-voltage equipment and insulating material for high-voltage equipment 有权
    制造用于高压设备的绝缘材料和绝缘材料绝缘树脂组合物的方法

    公开(公告)号：JP2012158622A

    公开(公告)日：2012-08-23

    申请号：JP2011017149

    申请日：2011-01-28

    Applicant: Kunimine Industries Co Ltd ,  Toshiba Corp ,  クニミネ工業株式会社 ,  株式会社東芝

    Inventor： YAMAZAKI KENICHI ,  IMAI TAKAHIRO ,  OZAKI TAMON ,  KOMIYA GEN ,  MURAYAMA KIYOKO ,  SAWA FUMIO ,  SHIMIZU TOSHIO ,  CHO HIROAKI ,  HONMA MITSUTAKA ,  KUROSAKA KEIICHI ,  KUBOTA MUNEHIRO

    IPC: C08L63/00 ,  C08K3/00 ,  C08K9/06 ,  H01B3/40

    Abstract: PROBLEM TO BE SOLVED: To provide a method in which a layered clay mineral can be uniformly dispersed in an epoxy resin without executing a treatment of making an organic substance by an intercalating method between layers, and that can decrease the environmental load.SOLUTION: The method of manufacturing an insulating resin composition for high-voltage equipment includes: (a) a process in which a layered clay mineral is swollen by either of water and a water-based mixing solvent to obtain a layered clay mineral-dispersed liquid; (b) a process in which a silane coupling agent is added to the layered clay mineral-dispersed liquid, so that the surface of the layered clay mineral is made to have an organic function to obtain an organic functionalized layered clay mineral-dispersed liquid; and (c) a process in which an epoxy resin and an organic solvent compatible with the epoxy resin are added to the organic functionalized layered clay mineral-dispersed liquid, to be kneaded.

    Abstract translation: 要解决的问题：提供一种方法，其中层状粘土矿物可以均匀分散在环氧树脂中，而不需要通过层之间的插层方法进行有机物质的处理，并且可以降低环境负荷。 解决方案：制造用于高压设备的绝缘树脂组合物的方法包括：（a）层状粘土矿物通过水和水基混合溶剂中的任一种溶胀而获得层状粘土矿物的方法 分散液体 （b）将层状粘土矿物分散液中添加硅烷偶联剂的方法，使层状粘土矿物的表面具有有机功能，得到有机官能化层状粘土矿物分散液; 和（c）将环氧树脂和与环氧树脂相容的有机溶剂加入有机官能化层状粘土矿物分散液中进行混炼的方法。 版权所有（C）2012，JPO＆INPIT

    Method for production of monosaccharide and/or oligosaccharides, and method for isolation of wood component
    3.
    发明专利
    Method for production of monosaccharide and/or oligosaccharides, and method for isolation of wood component 审中-公开
    单糖和/或低聚糖的生产方法和分离木质成分的方法

    公开(公告)号：JP2010057506A

    公开(公告)日：2010-03-18

    申请号：JP2009278461

    申请日：2009-12-08

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： AMANO YOSHIHIKO ,  KANDA TAKAHISA ,  MAKISHIMA SATOSHI ,  AKAI YOSHIE ,  HIRATA YOSUKE ,  SHIMIZU TOSHIO

    IPC: C12P19/14 ,  B09B3/00 ,  C12M1/00 ,  C12P19/02

    CPC classification number: Y02W30/78

    Abstract: PROBLEM TO BE SOLVED: To provide a method and system for effectively isolating cellulose, hemicellulose, lignin components by employing biomass resources as starting materials. SOLUTION: The method includes treatment of the biomass resources as starting materials with basidiomycete, rot fungi, and treating the product of treatment with hot liquid at high pressure. The product of treatment with hot liquid at high pressure is further, treated with an enzyme. The monosaccharides and/or oligosaccharides are effectively produced. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供通过使用生物质资源作为起始材料来有效分离纤维素，半纤维素，木质素成分的方法和系统。 解决方案：该方法包括以担子菌，腐烂真菌为原料处理生物质资源，并处理高压热液处理产物。 用高压热液处理的产物进一步用酶处理。 单糖和/或寡糖有效生产。 版权所有（C）2010，JPO＆INPIT

    Fiber reinforced composite material and electric appliance
    4.
    发明专利
    Fiber reinforced composite material and electric appliance 审中-公开
    纤维增强复合材料和电器

    公开(公告)号：JP2008248178A

    公开(公告)日：2008-10-16

    申请号：JP2007093642

    申请日：2007-03-30

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： SAWA FUMIO ,  IMAI TAKAHIRO ,  OZAKI TAMON ,  SHIMIZU TOSHIO ,  OKAMOTO TETSUSHI ,  HATANO HIROSHI ,  IWATA NORIYUKI

    IPC: C08J5/04 ,  C08J5/24 ,  C08K7/16 ,  C08L101/00

    Abstract: PROBLEM TO BE SOLVED: To provide a fiber-reinforced composite material improved in heat resistance, mechanical strengths and electro-discharge resistance in comparison with conventional fiber-reinforced composite materials, and electric appliances.
    SOLUTION: The fiber-reinforced composite material is prepared by adding a thermosetting resin to a fibrous base material. In the composite material, spherical particles having ≤100 nm average size are added to the thermosetting resin in the range of 1-10% weight ratio.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：与传统的纤维增强复合材料和电器相比，提供一种提高耐热性，机械强度和耐电镀性的纤维增强复合材料。 解决方案：纤维增强复合材料通过将热固性树脂加入到纤维基材中制备。 在复合材料中，平均粒径≤100nm的球形颗粒以1-10重量％的比例加入到热固性树脂中。 版权所有（C）2009，JPO＆INPIT

    Switching device
    5.
    发明专利
    Switching device 有权
    切换设备

    公开(公告)号：JP2006179290A

    公开(公告)日：2006-07-06

    申请号：JP2004370854

    申请日：2004-12-22

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： SHIOIRI SATORU ,  SATO JUNICHI ,  MAKISHIMA SATOSHI ,  KINOSHITA SUSUMU ,  SHIMIZU TOSHIO ,  SAKAGUCHI OSAMU ,  MIYAGAWA MASARU ,  YOKOKURA KUNIO

    IPC: H01H33/64 ,  H01H33/56

    CPC classification number: H01H33/24 ,  H01H2033/566

    Abstract: PROBLEM TO BE SOLVED: To improve voltage-withstanding characteristics between a pair of contacts of a switching device.
    SOLUTION: The switching device is provided with an insulating vessel 2 with insulating gas 15 sealed in, a fixed side conductive shaft 5 airtightly fixed to one of the openings of the insulating vessel 2, a fixed side contact 4 fitted at an end part of the fixed side conductive shaft in the insulating vessel 2, a movable side contact 6 fitted in free attachment and detachment to and from the fixed side contact 4, a movable side conductive shaft 7 moving freely in airtightness along the other opening of the insulating vessel 2, and an operating mechanism 17 coupled with the movable conductive shaft 7. The insulating vessel 2 is to be a multilayered insulating layer, with a specific inductive capacity getting larger toward an inner layer.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提高开关器件的一对触点之间的耐压特性。 解决方案：开关装置设有绝缘容器2，绝缘容器2具有密封的绝缘气体15，密封地固定到绝缘容器2的一个开口的固定侧导电轴5，固定侧接触件4安装在端部 绝缘容器2中的固定侧导电轴的一部分，与固定侧接触件4自由安装和拆卸配合的可动侧接触件6，沿着绝缘容器2的另一个开口的气密性自由移动的可动侧导电轴7 容器2以及与可动导电轴7连接的操作机构17构成。绝缘容器2为多层绝缘层，其电感性容量朝向内层变大。 版权所有（C）2006，JPO＆NCIPI

    Formation method for ground layer in molded electrical apparatus and sheath-grounded molded electrical apparatus
    7.
    发明专利
    Formation method for ground layer in molded electrical apparatus and sheath-grounded molded electrical apparatus 有权
    成型电气设备和地面成型电气设备中接地层的形成方法

    公开(公告)号：JP2005160162A

    公开(公告)日：2005-06-16

    申请号：JP2003392437

    申请日：2003-11-21

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： KINOSHITA SUSUMU ,  SATO JUNICHI ,  SAKAGUCHI OSAMU ,  KUBOTA NOBUTAKA ,  MIYAGAWA MASARU ,  ONO MASAMICHI ,  SAITO TOSHIHISA ,  SHIOIRI SATORU ,  MAKISHIMA SATOSHI ,  SHIMIZU TOSHIO

    IPC: H02B1/20 ,  H01B19/00 ,  H01H33/66 ,  H02B1/16 ,  H02B13/02

    Abstract: PROBLEM TO BE SOLVED: To easily form the ground layer of a sheath-grounded molded electrical apparatus in a short time. SOLUTION: A formation method for the ground layer of a sheath-grounded molded electrical apparatus comprises: a step in which silicone mold releasing agent is applied to a metal mold, and insulating material is molded with the metal mold with a main circuit end exposed to prepare an electrical apparatus with an insulating layer 2 formed thereon; a step in which paintable silicone compatible with the silicone mold releasing agent is applied to the outer face of the insulating layer 2; and a step in which epoxy-resin electrical conductive coating is applied to the outer face of the insulating layer 2 to form a ground layer 5. After the application of the paintable silicone, the epoxy-resin electrical conductive coating is applied with this state maintained. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：在短时间内容易地形成护套接地的模制电气设备的接地层。 解决方案：皮肤接地模制电气设备的接地层的形成方法包括：将硅氧烷脱模剂施加到金属模具的步骤，并且绝缘材料用具有主电路的金属模具模制 端部暴露以制备其上形成有绝缘层2的电气设备; 将与硅氧烷脱模剂相容的可涂布硅酮施加到绝缘层2的外表面的步骤; 以及将环氧树脂导电涂层施加到绝缘层2的外表面以形成接地层5的步骤。施加可涂漆的硅树脂后，施加该状态的环氧树脂导电涂层 。 版权所有（C）2005，JPO＆NCIPI

    SEMICONDUCTOR DEVICE
    9.
    发明专利
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：JP2003086764A

    公开(公告)日：2003-03-20

    申请号：JP2001276580

    申请日：2001-09-12

    Applicant: TOSHIBA CORP

    Inventor： SHIMIZU TOSHIO ,  HIRAMOTO HIROYUKI ,  SEKIYA HIRONORI ,  MATSUMOTO HISAAKI ,  KIJIMA KENJI

    IPC: H01L23/28 ,  H01L25/07 ,  H01L25/18

    Abstract: PROBLEM TO BE SOLVED: To provide a reliable semiconductor device excellent in insulation characteristics and heat-resistance cycle property. SOLUTION: The semiconductor device comprises, at least, an insulating substrate, a plurality of metal plates disposed on the insulating substrate, and a semiconductor element disposed on the metal plates. It comprises: (1) a solid insulator which coats a gap between adjoining metal plates and a slit formed at the solid insulator: (2) the solid insulator which coats the gap between adjoining metal plates and a film, instead of the slit, which is not adhesive to the solid insulator: and (3) a thermo-setting elastomer which is a flexible rubber-like material and coats the gap between the adjoining metal plates.

    BOARD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    10.
    发明专利
    BOARD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JP2002076197A

    公开(公告)日：2002-03-15

    申请号：JP2000254226

    申请日：2000-08-24

    Applicant: TOSHIBA CORP

    Inventor： SHIMIZU TOSHIO ,  HIRAMOTO HIROYUKI ,  SEKIYA HIRONORI ,  MATSUMOTO HISAAKI

    IPC: H01L23/28 ,  H01L23/13 ,  H01L23/15 ,  H01L23/29 ,  H01L23/31 ,  H01L25/07 ,  H01L25/18

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device superior in insulation withstand voltage characteristic and heat resistant cycle and rich in reliability. SOLUTION: The semiconductor device comprises a heat sink 5, an insulation board 1 on the heat sink 5, surface side conductor plates 21, 22, 23 arranged selectively on the insulation plate 1, semiconductor chips 31, 32 arranged on the surface side conductor plates 21, 22, 23, a solid insulator 11 brought into contact with the outer peripheral ends of the surface side conductor plates 21, 22, 23 and arranged on the upper face of the insulation board 1, a case 6 provided on the heat sink 5 so as to surround the insulation board 1, and a soft insulator 9 filled into the case 6. The solid insulator 11 has an intermediate thermal expansion coefficient between the thermal expansion coefficients of the surface side conductor plates 21, 22, 23 and the insulation board 1.

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