公开(公告)号：JP2660012B2

公开(公告)日：1997-10-08

申请号：JP22901288

申请日：1988-09-13

Applicant: TOSHIBA KK

Inventor： UCHIDA TAKESHI ,  AZUMA MICHA ,  KIHARA NAOKO ,  SHIMOZAWA HIROSHI ,  YOSHIZUMI AKIRA

IPC: C08L61/06 ,  C08G59/00 ,  C08G59/32 ,  C08G59/62 ,  C08L61/04 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2656356B2

公开(公告)日：1997-09-24

申请号：JP23757889

申请日：1989-09-13

Applicant: TOSHIBA KK

Inventor： MYAHARA SHOICHI ,  KAMAZAKI KEIJI ,  AZUMA MICHA

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

Abstract: In multimold semiconductor devices, semiconductor chips (4, 5) are mounted on a lead frame (3) and bonded with wire, sealed by an inner resin (1), and further enclosed by an outer resin (2). In particular, wax to be added to the inner resin (1) is at least one compound selected from the group consisting of ester group, fatty acid based, fatty acid metallic salt based, fatty alcohol, polyhydric alcohol, and fatty acid amide compounds. In the semiconductor devices sealed by the inner resin (1) including wax thus defined, since the adhesion strength between the inner and outer resins (1, 2) can be increased, peeling resistance between the two and the moisture resistance can be improved markedly and cracks after dip soldering can be perfectly eliminated, without effecting any conventional inner resin treatment such as honing, burning, after-curing, etc.

公开(公告)号：JP2654376B2

公开(公告)日：1997-09-17

申请号：JP18055095

申请日：1995-06-26

Applicant: TOSHIBA KK

Inventor： IKETANI HIROTOSHI ,  AZUMA MICHA

IPC: C08G59/62 ,  C08G59/40 ,  C08K5/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2642470B2

公开(公告)日：1997-08-20

申请号：JP4351089

申请日：1989-02-23

Applicant: TOSHIBA KK

Inventor： UCHIDA TAKESHI ,  YOSHIZUMI AKIRA ,  FUJEDA SHINETSU ,  AZUMA MICHA ,  SHIMOZAWA HIROSHI

IPC: C08K3/36 ,  C08G59/00 ,  C08G59/40 ,  C08K5/56 ,  C08L63/00 ,  C08L79/08 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2892087B2

公开(公告)日：1999-05-17

申请号：JP6253590

申请日：1990-03-15

Applicant: TOSHIBA KK

Inventor： FUJEDA SHINETSU ,  AZUMA MICHA ,  SHIMOZAWA HIROSHI ,  YOSHIZUMI AKIRA ,  KAO MIN TAI

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31

公开(公告)号：JP2786734B2

公开(公告)日：1998-08-13

申请号：JP25905690

申请日：1990-09-28

Applicant: TOSHIBA KK

Inventor： MORI MIKI ,  SAITO MASAYUKI ,  KAO MIN TAI ,  SAKAMOTO TSUGIO ,  AZUMA MICHA

IPC: H01L21/60

公开(公告)号：JP2953661B2

公开(公告)日：1999-09-27

申请号：JP7659588

申请日：1988-03-31

Applicant: TOSHIBA KK

Inventor： AZUMA MICHA ,  YOSHIZUMI AKIRA ,  FUJEDA SHINETSU

IPC: C09K3/10 ,  C08G59/00 ,  C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2937398B2

公开(公告)日：1999-08-23

申请号：JP8390890

申请日：1990-03-30

Applicant: TOSHIBA KK

Inventor： FUJEDA SHINETSU ,  MIKOGAMI TOMOKIMI ,  YOSHIZUMI AKIRA ,  AZUMA MICHA ,  SHIMOZAWA HIROSHI

IPC: H01L23/06 ,  H01L23/02 ,  H01L23/08

公开(公告)号：JP2892117B2

公开(公告)日：1999-05-17

申请号：JP20454190

申请日：1990-08-01

Applicant: TOSHIBA KK

Inventor： MORI MIKI ,  SAITO MASAYUKI ,  KAO MIN TAI ,  SAKAMOTO TSUGIO ,  AZUMA MICHA

IPC: H01L21/56