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公开(公告)号:DE102004058708B4
公开(公告)日:2009-04-16
申请号:DE102004058708
申请日:2004-12-06
Applicant: TOSHIBA KK
Inventor: MASUNAGA TAKAYUKI , OOFUCHI SHINOBU , ISOGAI HIROMICHI , KOJIMA KATSUYOSHI
IPC: B24B7/16 , B24B29/02 , B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
Abstract: A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.
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公开(公告)号:NL1038406A
公开(公告)日:2011-05-30
申请号:NL1038406
申请日:2010-11-25
Applicant: TOSHIBA KK
Inventor: MASUNAGA TAKAYUKI , YAMAZAKI HIROAKI
Abstract: According to one embodiment, an electrostatic actuator includes an electrode unit, a conductive film body unit, a plurality of first urging units, and a plurality of second urging units. The electrode unit is provided on a substrate. The conductive film body unit is provided opposing the electrode unit. The plurality of first urging units are provided at a first circumferential edge portion of the conductive film body unit to support the film body unit. The plurality of second urging units are provided at a second circumferential edge portion opposing the first circumferential edge portion to support the film body unit. The electrode unit and the conductive film body unit contact or separate by the electrode unit being set to a voltage having a prescribed value. The plurality of first urging units have mutually different rigidities, and the plurality of second urging units have mutually different rigidities.
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公开(公告)号:NL1038406C2
公开(公告)日:2011-06-30
申请号:NL1038406
申请日:2010-11-25
Applicant: TOSHIBA KK
Inventor: MASUNAGA TAKAYUKI , YAMAZAKI HIROAKI
Abstract: According to one embodiment, an electrostatic actuator includes an electrode unit, a conductive film body unit, a plurality of first urging units, and a plurality of second urging units. The electrode unit is provided on a substrate. The conductive film body unit is provided opposing the electrode unit. The plurality of first urging units are provided at a first circumferential edge portion of the conductive film body unit to support the film body unit. The plurality of second urging units are provided at a second circumferential edge portion opposing the first circumferential edge portion to support the film body unit. The electrode unit and the conductive film body unit contact or separate by the electrode unit being set to a voltage having a prescribed value. The plurality of first urging units have mutually different rigidities, and the plurality of second urging units have mutually different rigidities.
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公开(公告)号:NL1038406C
公开(公告)日:2011-06-30
申请号:NL1038406
申请日:2010-11-25
Applicant: TOSHIBA KK
Inventor: MASUNAGA TAKAYUKI , YAMAZAKI HIROAKI
CPC classification number: H01H59/0009 , B81B3/007 , B81B2201/018 , B81B2201/045 , B81B2203/0109 , B81B2203/0172 , H02N1/006
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公开(公告)号:DE102004058708A1
公开(公告)日:2005-08-18
申请号:DE102004058708
申请日:2004-12-06
Applicant: TOSHIBA KK
Inventor: MASUNAGA TAKAYUKI , OOFUCHI SHINOBU , ISOGAI HIROMICHI , KOJIMA KATSUYOSHI
IPC: B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , B24B7/16 , B24B29/02
Abstract: A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface of the support plate and the head body, a second recessed portion formed in a lower surface of the support plate, a second film-like member, in which a second space is formed between the second film-like member and the support plate, and which holds a wafer on the lower, a communicating hole which is formed in the support plate to communicate the first space with the second space, and a gas supply device which increases pressures in the first and second spaces with a fluid to equal pressures to bring the object into press contact with the polishing pad.
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