公开(公告)号：WO2010096707A3

公开(公告)日：2010-08-26

申请号：PCT/US2010/024807

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  DESTA, Yohannes ,  HUANG, Chang ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

Inventor： DESTA, Yohannes ,  HUANG, Chang ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

IPC: H01L21/66

Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.

公开(公告)号：WO2010096711A2

公开(公告)日：2010-08-26

申请号：PCT/US2010/024813

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

Inventor： DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

IPC: H01L21/66

CPC classification number: G01R1/07378

Abstract: Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are pianarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.

Abstract translation: 探针接触器基板上的微电子接触器或探针接触器或空间变压器基板上的粘合元件由牺牲材料保护，因为1）微电子接触器或粘合元件被钢化，或2）基板的表面，微电子 形成接触器或粘合剂元件。 粘合元件用于将探针接触器基板粘合到空间变换器基板。

公开(公告)号：EP1869528A1

公开(公告)日：2007-12-26

申请号：EP05845202.0

申请日：2005-11-18

Applicant: Touchdown Technologies, Inc.

Inventor： TANG, Weilong ,  HSU, Tseng-Yeng ,  ISMAIL, Salleh ,  TEA, Nim, Hak ,  KHOO, Melvin, B. ,  GARABEDIAN, Raffi ,  NAMBURI, Lakshmikanth

IPC: G03F7/00

CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

公开(公告)号：WO2010096714A2

公开(公告)日：2010-08-26

申请号：PCT/US2010/024817

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

Inventor： DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

IPC: H01L21/66

CPC classification number: G01R1/07378

Abstract: A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mouni technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through- hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor aid space transformer substrates.

Abstract translation: 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面摩尼技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而靠近探针接触器基板上的导电元件，该空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器辅助空间变压器基板之间。

公开(公告)号：WO2009011696A1

公开(公告)日：2009-01-22

申请号：PCT/US2007/073579

申请日：2007-07-16

Applicant: TOUCHDOWN TECHNOLOGIES, INC

Inventor： NAMBURI, Lakshmikanth

IPC: G01R31/02 ,  H01L21/00 ,  H05K3/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/07342

Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage. A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card. A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.

Abstract translation: 公开了一种用于修复MEMS系统的新型装置和方法，包括用于半导体测试的探针卡。 在一个实施例中，与用于测试半导体晶片的诊断计算机一起使用的探针卡包括衬底，连接到衬底的多个操作探针，其中多个操作探针适于与诊断计算机进行电连接， 多个连接到基板的替换探针，其中多个操作探针和多个置换探针构成在基本上相同的制造过程中。 还公开了可以修复的新型探针卡。 具体地说，探针卡与用于测试半导体晶片的诊断计算机一起使用的探针卡，所述探针卡包括衬底和连接到所述衬底的探测器的多个操作，其中所述多个操作探针适于与所述诊断计算机进行电连接 ，并且其中所述多个操作探针包括通过施加电压而被激活的牺牲材料。 还公开了一种从探针卡中去除损坏的探针的方法。 该方法从包括连接到基板的多个操作探针的探针卡移除损坏的探针，并且多个操作探针包括通过施加电压而被激活的牺牲材料。 该方法包括识别损坏的探针，向损坏的探针施加电压，将损坏的探针暴露于蚀刻溶液中，并从探针卡上移除损坏的探针。 还公开了用于从探针卡修复损坏的探针的第二种方法。 该方法修复来自探针卡的损坏的探针，所述探针卡包括连接到基底的多个操作探针和连接到所述基底的多个替代探针，并且其中所述多个操作探针和所述多个置换探针基本相同 制造工艺。 该方法包括以下步骤：识别损坏的探针，从探针卡移除损坏的探针，将多个置换探针中的一个与基底分开，以及安装从多个替换探针分离的一个探针，其中损坏的探针被去除 。 公开了对这些装置和方法的若干改进。

公开(公告)号：WO2006068737A1

公开(公告)日：2006-06-29

申请号：PCT/US2005/041661

申请日：2005-11-18

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： TANG, Weilong ,  HSU, Tseng-Yeng ,  ISMAIL, Salleh ,  TEA, Nim, Hak ,  KHOO, Melvin, B. ,  GARABEDIAN, Raffi ,  NAMBURI, Lakshmikanth

IPC: G03F7/00

CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。