公开(公告)号：WO2008153558A3

公开(公告)日：2009-04-09

申请号：PCT/US2007069896

申请日：2007-05-29

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： KARKLIN KEN ,  GARABEDIAN RAFFI

IPC: G01R31/02

CPC classification number: G01R1/0735 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2224/48 ,  H01L2924/00

Abstract: A novel device for testing semiconductor chips is disclosed A benefit with all the embodiments described herein is that the device may expepence zero (or near zero) nascent force The device may be comppsed of a printed circuit board (PCB)that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer When the PCB piercing structure and the substrate piercing structure pierce the elastomer, the PCB becomes electrically connected to the probe contactor Instead of the piercing structure, the PCB or the probe contractor substrate may be adhered to the elastomer by an adhesive, such that the PCB becomes electrically connected to the probe contactor

Abstract translation: 公开了一种用于测试半导体芯片的新型器件。本文所述的所有实施例的优点在于，器件可以超过零（或近零）新生力。该器件可以由具有至少一个PCB的印刷电路板（PCB） 穿孔结构，具有至少一个基板穿孔结构的探针接触器基板，其中所述基板穿孔结构电连接到探针接触器，以及具有至少一个由导电弹性体制成的电通路的插入件当所述PCB穿孔结构和 基板刺穿结构刺穿弹性体，PCB变得电连接到探针接触器代替穿孔结构，PCB或探针承载基底可以通过粘合剂粘附到弹性体上，使得PCB变得电连接到探针 接触