Abstract:
A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.
Abstract:
A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.
Abstract:
A probe card assembly (300) has a probe contactor substrate (310) having a plurality of probe contactor tips (395) thereon and a probe card wiring board (330) with an interposer (340) disposed between the two. Support posts (320) contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism (380) which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
Abstract in simplified Chinese:本发明系关于一种探针,用以和一微电子设备上之接触触点产生电连接。一足部连接至一基板,该足部具有一长度、一厚度、一宽度、一近端、以及一远程。该足部的长度大于其宽度。一扭杆,其具有一长度、一宽度、一厚度、一近端、以及一远程,该扭杆于其近端处连接至该足部的远程。该扭杆系座落在第一平面中。一分隔体,其具有一长度、一宽度、以及一厚度,其系被连接至该扭杆的远程。一臂部,其具有一长度、一宽度、一厚度、一近端、以及一远程,该臂部会于其近端处被连接至该分隔体。该臂部系座落在第二平面中,且该第二平面系位在不同于该第一平面的平面中。一第一支柱,其具有一顶端侧与一底部侧,其会在靠近该臂部的远程处连接至该臂部。一尖端,其电连接至该支柱的顶端侧。
Abstract in simplified Chinese:一种用于测试半导体组件之合成探针,系包含一扭力构件以及一弯曲构件,该等构件允许该探针以扭力式或弯曲式方式存储该位移能量;该创新合成探针包含一探针基座、一扭力构件、一弯曲构件、以及一探针尖端,当该探针尖端接触该DUT接触焊垫时,该探针弹性地形变以吸收该位移能量,该弯曲构件借由弯曲吸收部分该位移能量;因为该扭力构件以及该弯曲构件以一角度聚合,该位移能量之一部分转移至该扭力构件造成其扭曲(扭力),该扭力构件亦可弯曲以借由扭曲以及弯曲存储能量,而且调整一枢纽之位置可以运用以改变该探针之能量吸收特征;一或多个附加有角构件亦可增加以改变该探针之能量吸收特征,而且该扭力及/或弯曲构件之该转动惯量亦可运用以达成该默认探针特征。
Abstract:
A probe card assembly (300) has a probe contactor substrate (310) having a plurality of probe contactor tips (395) thereon and a probe card wiring board (330) with an interposer (340) disposed between the two. Support posts (320) contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism (380) which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
Abstract in simplified Chinese:一种用以修复微机电系统的器件及方法,系揭露一种新颖的用以修复MEMS系统(包括供半导体测试使用的探针卡)的器件及方法;在本发明之一个实施例中,一探针卡伴随一诊断电脑使用,以测试半导体晶圆,包含:一基板;复数个作业探针,连接于该基板,其中该复数个作业探针经配接而与该诊断电脑做电性连接;及复数个替换探针,连接于该基板,其中该复数个作业探针和该复数个替换探针系以实质上相同的制程所建构。本发明也揭露一种新颖的可修复的探针卡。具体而言,系一探针卡伴随一诊断电脑使用,以测试半导体晶圆,该探针卡包含:一基板;及复数个作业探针,连接于该基板,其中该复数个作业探针经配接而与该诊断电脑做电性连接,且其中该复数个作业探针包含一藉施电压致动的牺牲层。本发明也揭露一种用以从一探针卡移除一毁坏的探针的方法。该方法从一探针卡移除一毁坏的探针,而该探针卡系包含复数个连接于一基板的作业探针,且该复数个作业探针包含该毁坏的探针及一藉施电压致动的牺牲层。该方法包含:验明毁坏的探针;施加电压于该毁坏的探针;将该毁坏的探针曝露于一蚀刻溶液;及从该探针卡移除该毁坏的探针。本发明另揭露一种用以从一探针卡修复一毁坏的探针的方法。该方法从一探针卡修复一毁
坏的探针,而该探针卡包含复数个连接于一基板的作业探针及复数个连接于该基板的替换探针,其中该复数个作业探针和该复数个替换探针系由实质上相同的制程所建构。该方法包含步骤:验明毁坏的作业探针;从该探针卡移除该毁坏的作业探针;从该基板分离出该复数个替换探针其一;及将从该复数个替换探针分离出的一个探针装设在该毁坏的作业探针被移除处;本发明揭露若干对此等器件及方法的改良。
Abstract in simplified Chinese:本发明与在基板上形成微结构的方法相关。施加一个电镀表面于基板上。第一光阻层施加在电镀基材之上。第一光阻层以一个辐射线图案暴露,以提供在第一图案内可溶解的第一光阻层。除去可溶解光阻,然后电镀第一层主要金属在除去第一光阻层的区域上。然后除去剩余的光阻部分,并且施加第二光阻层在电镀基材以及第一层主要金属上。第二光阻层然后暴露于第二辐射图案,以使得光阻可溶解并且除去可溶解的光阻。第二图案是一个围绕主要结构的区域,但是它不包含整个基板。相反地它是围绕主要金属的一个岛。然后机械加工次要金属的暴露表面到主要金属要求的一个高度。次要金属然后被蚀刻掉。
Abstract in simplified Chinese:本发明系关于一种插入器,其具有一具有一上表面与一下表面的插入器基板,以及一具有一上方部与一下方部的至少一弹性接触组件。该上方部会以大致垂直的方式延伸在该插入器基板的上表面上方,且该下方部会以大致垂直的方式延伸在该插入器基板的下表面下方。该弹性接触组件的该等上方部与下方部在平行该基板的方向上大致上系有弹性的。