公开(公告)号：WO2008113767A2

公开(公告)日：2008-09-25

申请号：PCT/EP2008053121

申请日：2008-03-14

Applicant: TOURNE TECHNOLOGIES BV ,  TOURNE JOSEPH A A M

Inventor： TOURNE JOSEPH A A M

CPC classification number: H05K3/429 ,  H05K1/0237 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/4069 ,  H05K2201/0187 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/10734 ,  H05K2203/1476

Abstract: A method of making a circuit board comprising the steps of: (1) forming two or more metallized vias through at least a portion of a circuit board; and (2) forming an isolation opening between the two or more metallized vias, whereby at least a portion of the metallization is removed from at least one of the two or more vias.

Abstract translation: 一种制造电路板的方法，包括以下步骤：（1）通过电路板的至少一部分形成两个或多个金属化通孔; 和（2）在两个或更多个金属化通孔之间形成隔离开口，由此至少一部分金属化从两个或更多个通孔中的至少一个去除。

公开(公告)号：WO2005029928A3

公开(公告)日：2005-12-29

申请号：PCT/US2004030490

申请日：2004-09-17

Applicant: VIASYSTEM GROUP INC ,  TOURNE JOSEPH A A M ,  LEBENS PATRICK P P

Inventor： TOURNE JOSEPH A A M ,  LEBENS PATRICK P P

IPC: H02H1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  B23P19/04 ,  H01R12/04

CPC classification number: H05K3/0047 ,  H05K1/0237 ,  H05K1/0268 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T408/03 ,  Y10T408/173 ,  Y10T408/175

Abstract: A multilayer circuit board (16) is provided with at least one signasl layer (20), at least one feedback layer (22), ans at least one dielectric layer (24) positioned between the signal layer (20) and the feedback layer (22). The signal layer (20) is connected to at least one plated hole (12). The feedback layer (22) has a contact pad (26), which is positioned adjacent to the plated hole (12), but is electrically isolated from the plated hole (12). The contact pad (26) is connected to a measurement unit (48). The dielectric layer (22) is positioned between the signal layer (20) and the contact pad (26) of the feedback layer (22). A portion of the plated hole (12) forms a stub portion (18), which extends a distance away from the signal layer (20) and typically extends a distance away from the contact pad (26) of the feedback layer (22). To remove the stub portion (18), a hole is bored or routed into the multilayer circuit board (16) until electrical feedback is received by the measurement unit (48) upon contact of a portion of the boring device (40) with the contact pad (26) Upon receipt of the electrical feedback by the measurement unit (48), theboring device (40) is retracted from the hole, and the hole formed by the borijng device (40) is filled with an epoxy, or other filler material.

Abstract translation: 多层电路板（16）设置有至少一个信号层（20），至少一个反馈层（22）和至少一个位于信号层（20）和反馈层（20）之间的介电层（24） 22）。 信号层（20）连接到至少一个电镀孔（12）。 反馈层（22）具有接触焊盘（26），其位于邻近电镀孔（12）的位置，但与电镀孔（12）电隔离。 接触垫（26）连接到测量单元（48）。 电介质层（22）位于信号层（20）和反馈层（22）的接触焊盘（26）之间。 电镀孔（12）的一部分形成短路部分（18），该短截线部分（18）延伸离开信号层（20）一定距离，并且通常距离反馈层（22）的接触焊盘（26）一定距离。 为了去除短截线部分（18），孔被钻孔或布线到多层电路板（16）中，直到当钻孔装置（40）的一部分与触点接触时由测量单元（48）接收到电反馈 垫（26）当由测量单元（48）接收到电反馈时，钻孔装置（40）从孔中缩回，由钻孔装置（40）形成的孔填充有环氧树脂或其它填充材料 。