公开(公告)号：EP1795951A1

公开(公告)日：2007-06-13

申请号：EP06124483.6

申请日：2006-11-21

Applicant: TPO Displays Corp.

Inventor： Liu, Cheng-Hung

IPC: G02F1/13357 ,  G02B6/00 ,  F21V29/00

CPC classification number: F21V29/86 ,  F21K9/00 ,  F21V29/83 ,  G02B6/003 ,  G02B6/0083 ,  G02B6/0085 ,  G02F1/133603 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/10106

Abstract: A cooling scheme for an LED based back-light in a liquid crystal display (LCD) is disclosed. A circuit board (10) in the LED backlight (300) of the LCD (100) has a thermally (and (optionally) electrically) conductive material (M) arranged to completely fill at least one through-hole (H) joining its front (101) and back (102) surfaces in order to facilitate the efficient removal of heat from at least one LED (40) mounted its the front surface.
The high thermal conductivity material can have a large surface area at the back side of the circuit board in order to further increase heat removal. An additional thermally conducting medium (20) in contact with the material (M) ensures efficient heat transport to a surrounding frame (30), which acts as a heat sink. The holes in the PCB may be located in regions between the LEDs or under them. They may have different sizes. Larger holes may be provided under the LEDs. The material in the holes may also be electrically conducting to allow an electric contact to the LED terminals (41) to be made. The further thermally conducting medium may be a three layer structure, the two outer layers which are electrically insulating sandwiching an electrically conductive middle layer.

Abstract translation: 公开了一种用于液晶显示器（LCD）中的基于LED的背光的冷却方案。 LCD（100）的LED背光源（300）中的电路板（10）具有热（和（任选地）电气的）导电材料（M），其布置成完全填充连接其前部的至少一个通孔（H） （101）和后（102）表面，以便于有效地从安装在其前表面上的至少一个LED（40）去除热量。 高导热性材料可以在电路板的背面具有大的表面积，以便进一步增加散热。 与材料（M）接触的另外的导热介质（20）确保了有效的热传递到作为散热器的周围框架（30）。 PCB中的孔可以位于LED之间或其下的区域中。 他们可能有不同的大小。 可以在LED下面提供更大的孔。 孔中的材料也可以是导电的，以允许与LED端子（41）的电接触。 进一步的导热介质可以是三层结构，两个外层电绝缘夹着导电中间层。