公开(公告)号：EP0797763A1

公开(公告)日：1997-10-01

申请号：EP95943768.0

申请日：1995-12-08

Applicant: Tencor Instruments

Inventor： NIKOONAHAD, Mehrdad ,  STOKOWSKI, Stanley, E.

IPC: G01B11 ,  G01N21 ,  G01R31 ,  G06T1 ,  G06T7 ,  H01L21

CPC classification number: G01N21/95623 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8825 ,  G01R31/2831 ,  G01R31/308 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A high sensitivity and high throughput surface inspection system directs a focused beam of light (38) at a grazing angle towards the surface to be inspected (40). Relative motion is caused between the beam (38) and the surface (40) so that the beam (38) scans a scan path covering substantially the entire surface and light scattered along the path is collected for detecting anomalies. The scan path comprises a plurality of arrays of straight scan path segments. The focused beam of light (38) illuminates an area of the surface between 5-15 microns in width and this system is capable of inspecting in excess of about 40 wafers per hour for 150 millimeter diameter wafers (6-inch wafers), in excess of about 20 wafers per hour for 200 millimeter diameter wafers (8-inch wafers) and in excess of about 10 wafers per hour for 300 millimeter diameter wafers (12-inch wafers).