公开(公告)号：WO2019010488A1

公开(公告)日：2019-01-10

申请号：PCT/US2018/041270

申请日：2018-07-09

Applicant: THIN FILM ELECTRONICS ASA ,  SREENIVASAN, Raghav ,  CHANDRA, Aditi ,  KAMATH, Arvind

Inventor： SREENIVASAN, Raghav ,  CHANDRA, Aditi ,  KAMATH, Arvind

IPC: H01L21/22 ,  H01L21/228 ,  H01L21/318

CPC classification number: H01L21/228 ,  H01L21/0228 ,  H01L21/02288 ,  H01L21/02532 ,  H01L21/02628 ,  H01L21/2225 ,  H01L21/2254 ,  H01L21/324 ,  H01L21/823814 ,  H01L21/823864 ,  H01L23/5329 ,  H01L27/092 ,  H01L27/1292 ,  H01L29/66757 ,  H01L29/66772 ,  H01L29/78618

Abstract: A method of making a MOS device, a MOS device containing an aluminum nitride layer, and a CMOS circuit are disclosed. The method includes depositing an aluminum nitride layer on a structure including a silicon layer, depositing a dopant ink on the structure, and diffusing the dopant through the aluminum nitride layer into the silicon layer. The structure also includes a gate oxide layer on the silicon layer and a gate on the gate oxide layer. The dopant ink includes a dopant and a solvent. The MOS device includes a silicon layer, a gate oxide layer on the silicon layer, a gate on the gate oxide layer, and an aluminum nitride layer on the gate. The silicon layer includes a dopant on opposite sides of the gate.

公开(公告)号：WO2017024283A1

公开(公告)日：2017-02-09

申请号：PCT/US2016/045909

申请日：2016-08-05

Applicant: THIN FILM ELECTRONICS ASA ,  CHANDRA, Aditi ,  KAMATH, Arvind ,  MUKHERJEE, Somnath ,  TAKASHIMA, Mao ,  WONG, Gloria ,  VAN TU, Khanh ,  LI, Joey ,  POPIOLEK, Anton

Inventor： CHANDRA, Aditi ,  KAMATH, Arvind ,  MUKHERJEE, Somnath ,  TAKASHIMA, Mao ,  WONG, Gloria ,  VAN TU, Khanh ,  LI, Joey ,  POPIOLEK, Anton

IPC: H01Q1/52

CPC classification number: H01Q1/2291 ,  H01Q7/06

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

Abstract translation: 公开了一种无线通信装置及其制造和使用方法。 无线通信设备包括其上具有天线和/或电感器的基板，与天线和/或电感器重叠的图案化铁氧体层，以及电连接到天线和/或电感器的电容器。 无线通信设备还可以包括集成电路，其包括被配置为将第一无线信号转换为电信号的接收机和被配置为生成第二无线信号的发射机，所述天线被配置为接收第一无线信号并发送或广播 第二无线信号。 图案化的铁氧体层有利地减轻金属物体在与磁体耦合到天线的读取器和/或应答器附近的有害影响。

公开(公告)号：EP3332450A1

公开(公告)日：2018-06-13

申请号：EP16833980.2

申请日：2016-08-05

Applicant: Thin Film Electronics ASA

Inventor： CHANDRA, Aditi ,  KAMATH, Arvind ,  MUKHERJEE, Somnath ,  TAKASHIMA, Mao ,  WONG, Gloria ,  VAN TU, Khanh ,  LI, Joey ,  POPIOLEK, Anton

IPC: H01Q1/52

CPC classification number: H01Q1/2291 ,  H01Q7/06

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

公开(公告)号：EP2436037B1

公开(公告)日：2020-04-15

申请号：EP10781242.2

申请日：2010-05-27

Applicant: Thin Film Electronics ASA

Inventor： KAMATH, Arvind ,  KOCSIS, Michael ,  MCCARTHY, Kevin ,  WONG, Gloria, Man Ting

IPC: H01L31/02 ,  H01L27/12 ,  H01L29/786

公开(公告)号：EP2145350B1

公开(公告)日：2020-04-15

申请号：EP08755038.0

申请日：2008-05-03

Applicant: Thin Film Electronics ASA

Inventor： SCHER, Erik ,  KAMATH, Arvind ,  ROCKENBERGER, Joerg ,  MORI, Ikuo ,  MOLESA, Steven

IPC: H01L21/00 ,  H01L21/84 ,  C09D11/00 ,  C09D11/10 ,  H01L21/02 ,  H01L21/20 ,  H01L21/28

公开(公告)号：EP2286391B1

公开(公告)日：2019-08-14

申请号：EP09747739.2

申请日：2009-05-15

Applicant: Thin Film Electronics ASA

Inventor： SMITH, Patrick ,  CHOI, Criswell ,  CLEEVES, James Montague ,  SUBRAMANIAN, Vivek ,  KAMATH, Arvind ,  MOLESA, Steven

IPC: G08B13/08 ,  B31D1/02 ,  G06K19/077 ,  G08B13/24 ,  H01G4/18