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    HUMIDITY SENSOR, WIRELESS DEVICE INCLUDING THE SAME, AND METHODS OF MAKING AND USING THE SAME
    1.
    发明申请
    HUMIDITY SENSOR, WIRELESS DEVICE INCLUDING THE SAME, AND METHODS OF MAKING AND USING THE SAME 审中-公开
    湿度传感器，包括其的无线设备及其制造和使用方法

    公开(公告)号：WO2017024281A1

    公开(公告)日：2017-02-09

    申请号：PCT/US2016/045906

    申请日：2016-08-05

    Applicant: THIN FILM ELECTRONICS ASA ,  TAKASHIMA, Mao ,  CHANDRA, Aditi

    Inventor： TAKASHIMA, Mao ,  CHANDRA, Aditi

    IPC: H04W74/08 ,  H04W84/22

    CPC classification number: G06K19/07779 ,  G06K19/0702 ,  G06K19/0717

    Abstract: A tag or smart label including a humidity sensor, and methods of manufacturing and using the same, are disclosed. The tag or smart label includes a substrate or backplane with a battery or antenna, a humidity sensor, and an integrated circuit thereon. The integrated circuit is in electrical communication with the humidity sensor and the antenna or battery, and is configured to process a signal from the humidity sensor corresponding to the humidity level or value in the environment to be monitored, and provide or generate a signal that represents the humidity level/value. The humidity sensor includes first and second electrodes that are a predetermined distance apart, a humidity-sensitive material having one or more electrical, mechanical or chemical properties that vary as a function of the humidity level / value, and a water- and/or humidity-permeable membrane covering the humidity-sensitive material.

    Abstract translation: 公开了包括湿度传感器的标签或智能标签及其制造和使用方法。 标签或智能标签包括具有电池或天线的基板或背板，湿度传感器及其上的集成电路。 集成电路与湿度传感器和天线或电池电气通信，并且被配置为处理来自湿度传感器的信号，该湿度传感器对应于要监视的环境中的湿度水平或值，并且提供或产生表示 湿度水平/值。 湿度传感器包括隔开预定距离的第一和第二电极，具有根据湿度水平/值变化的一个或多个电气，机械或化学性质的湿度敏感材料以及水和/或湿度 透湿膜覆盖湿度敏感材料。

    ELECTRONIC DEVICE HAVING AN ANTENNA, METAL TRACE (S) AND/OR INDUCTOR WITH A PRINTED ADHESION PROMOTER THEREON
    2.
    发明申请
    ELECTRONIC DEVICE HAVING AN ANTENNA, METAL TRACE (S) AND/OR INDUCTOR WITH A PRINTED ADHESION PROMOTER THEREON 审中-公开
    具有印刷粘合促进剂的天线，金属跟踪和/或电感器的电子器件

    公开(公告)号：WO2017062662A1

    公开(公告)日：2017-04-13

    申请号：PCT/US2016/055817

    申请日：2016-10-06

    Applicant: THIN FILM ELECTRONICS ASA ,  TAKASHIMA, Mao ,  BOYD, Jacob ,  CHANDRA, Aditi

    Inventor： TAKASHIMA, Mao ,  BOYD, Jacob ,  CHANDRA, Aditi

    IPC: H05K3/12 ,  H05K3/36 ,  H05K1/16 ,  G06K19/07 ,  H01Q1/27 ,  H01Q23/00 ,  G08B13/24

    CPC classification number: G06K19/07 ,  G08B13/24 ,  H01Q1/2225 ,  H01Q7/005 ,  H05K1/16 ,  H05K3/12 ,  H05K3/36

    Abstract: An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.

    Abstract translation: 公开了电子装置及其制造方法。 制造电子器件的一种方法包括在第一衬底上形成第一金属层，在第二衬底上形成电子器件，在电气器件的输入和/或输出端上形成电连接器，至少选择性地沉积第二金属 第一金属层的一部分，并且通过使电连接器与第二金属接触而将电连接器电连接到第一金属层。 第二种金属与第一种金属不同。 第二金属改善了第一金属层与电气装置上的电连接器的粘合性和/或电连接性。

    ELECTRONIC DEVICE HAVING A PLATED ANTENNA AND/OR TRACE, AND METHODS OF MAKING AND USING THE SAME
    4.
    发明申请
    ELECTRONIC DEVICE HAVING A PLATED ANTENNA AND/OR TRACE, AND METHODS OF MAKING AND USING THE SAME 审中-公开
    具有镀层天线和/或迹线的电子装置，以及制造和使用该装置的方法

    公开(公告)号：WO2017100752A2

    公开(公告)日：2017-06-15

    申请号：PCT/US2016/066137

    申请日：2016-12-12

    Applicant: THIN FILM ELECTRONICS ASA ,  TAKASHIMA, Mao

    Inventor： TAKASHIMA, Mao

    IPC: H01Q5/40 ,  H01L21/64

    CPC classification number: H01L23/49822 ,  H01L21/4867 ,  H01L23/49855 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

    Abstract: An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.

    Abstract translation: 公开了一种电子设备及其制造方法。 制造电子器件的方法包括在第一衬底上形成第一金属层，在第二衬底上形成集成电路或分立电子部件，在集成电路或分立电子部件的输入和/或输出端子上形成电连接器 ，在所述第一金属层上形成第二金属层，所述第二金属层改善所述第一金属层对所述集成电路或分立电气部件上的所述电连接器的附着和/或电连接性，以及将所述电连接器电连接到所述第二 金属层。

    WIRELESS COMMUNICATION DEVICE WITH INTEGRATED FERRITE SHIELD AND ANTENNA, AND METHODS OF MANUFACTURING THE SAME
    5.
    发明申请
    WIRELESS COMMUNICATION DEVICE WITH INTEGRATED FERRITE SHIELD AND ANTENNA, AND METHODS OF MANUFACTURING THE SAME 审中-公开
    具有集成的铁氧体屏蔽和天线的无线通信装置及其制造方法

    公开(公告)号：WO2017024283A1

    公开(公告)日：2017-02-09

    申请号：PCT/US2016/045909

    申请日：2016-08-05

    Applicant: THIN FILM ELECTRONICS ASA ,  CHANDRA, Aditi ,  KAMATH, Arvind ,  MUKHERJEE, Somnath ,  TAKASHIMA, Mao ,  WONG, Gloria ,  VAN TU, Khanh ,  LI, Joey ,  POPIOLEK, Anton

    Inventor： CHANDRA, Aditi ,  KAMATH, Arvind ,  MUKHERJEE, Somnath ,  TAKASHIMA, Mao ,  WONG, Gloria ,  VAN TU, Khanh ,  LI, Joey ,  POPIOLEK, Anton

    IPC: H01Q1/52

    CPC classification number: H01Q1/2291 ,  H01Q7/06

    Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

    Abstract translation: 公开了一种无线通信装置及其制造和使用方法。 无线通信设备包括其上具有天线和/或电感器的基板，与天线和/或电感器重叠的图案化铁氧体层，以及电连接到天线和/或电感器的电容器。 无线通信设备还可以包括集成电路，其包括被配置为将第一无线信号转换为电信号的接收机和被配置为生成第二无线信号的发射机，所述天线被配置为接收第一无线信号并发送或广播 第二无线信号。 图案化的铁氧体层有利地减轻金属物体在与磁体耦合到天线的读取器和/或应答器附近的有害影响。

    WIRELESS TAGS WITH PRINTED STUD BUMPS, AND METHODS OF MAKING AND USING THE SAME
    6.
    发明申请
    WIRELESS TAGS WITH PRINTED STUD BUMPS, AND METHODS OF MAKING AND USING THE SAME 审中-公开
    带有印刷钻头的无线标签及其制造和使用方法

    公开(公告)号：WO2017024278A1

    公开(公告)日：2017-02-09

    申请号：PCT/US2016/045900

    申请日：2016-08-05

    Applicant: THIN FILM ELECTRONICS ASA ,  TAKASHIMA, Mao ,  MEI, Junfeng ,  LI, Joey

    Inventor： TAKASHIMA, Mao ,  MEI, Junfeng ,  LI, Joey

    IPC: G06K19/077 ,  H01Q1/22 ,  H01Q1/38

    CPC classification number: G06K19/077 ,  H01Q1/2225

    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.

    Abstract translation: 公开了无线（例如，近场或RF）通信设备及其制造方法。 制造无线通信装置的方法包括在第一基板上形成集成电路，在集成电路的输入和/或输出端上印刷凸块凸块，在第二基板上形成天线，并将天线的端部电连接到 螺柱颠簸 天线被配置为（i）接收和（ii）发送或广播无线信号。

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