公开(公告)号：US09386693B2

公开(公告)日：2016-07-05

申请号：US14269736

申请日：2014-05-05

Applicant: Tim Gruhl

Inventor： Tim Gruhl

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  B29C67/00 ,  H01L21/48 ,  H05K3/40 ,  B29L31/34 ,  H05K3/12

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过沉积第一多个层并通过在第一多个层的至少一部分上沉积第二多个层来形成与印刷电路板一体的互连来形成印刷电路板。 互连包括稳定结构和位于稳定结构内的接触。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。

公开(公告)号：US20150319850A1

公开(公告)日：2015-11-05

申请号：US14269736

申请日：2014-05-05

Applicant: Tim Gruhl

Inventor： Tim Gruhl

IPC: H05K1/02 ,  H05K3/40 ,  B29C67/00 ,  H05K3/46

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过沉积第一多个层并通过在第一多个层的至少一部分上沉积第二多个层来形成与印刷电路板一体的互连来形成印刷电路板。 互连包括稳定结构和位于稳定结构内的接触。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。