公开(公告)号：JP2004010810A

公开(公告)日：2004-01-15

申请号：JP2002168189

申请日：2002-06-10

Applicant: UBE INDUSTRIES

Inventor： OZAWA HIDEO ,  KODA MASAFUMI ,  WATANABE YOSHIAKI

IPC: C08G59/42 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a non-solvent type and one-pack epoxy resin composition being able to preferably form a sealing filler in a gap between a chip part and a wiring circuit board, by applying or dropping the composition on the surface of the chip part or the wiring circuit board in advance, arranging them and then jointing them under heating with a bump on a flipchip mounting, and the sealing filler comprising the cured material obtained by heating and curing the composition. SOLUTION: The one-pack epoxy resin composition with a viscosity over 250 poise at 25°C is prepared by mixing an epoxy resin and an acid anhydride-type curing agent being an imide-type oligomer having an imide unit represented by formula (1) in image 1 and an acid anhydride group at the chain terminal. In the formula (1), A is a tetracarboxylic acid residue and B is a diaminopolysiloxane residue. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003162055A

公开(公告)日：2003-06-06

申请号：JP2001359790

申请日：2001-11-26

Applicant: UBE INDUSTRIES

Inventor： OZAWA HIDEO ,  KODA MASAFUMI ,  WATANABE YOSHIAKI

IPC: G03F7/027 ,  C08F299/02 ,  G03F7/004 ,  G03F7/075 ,  G03F7/40 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a relatively low curing temperature and giving an insulating film which has excellent film properties such as heat resistance and flexibility, is developable with an aqueous alkali solution, and has small warpage and to provide a photosensitive film, an insulating film and a method for forming the same. SOLUTION: The alkali-soluble photosensitive resin composition comprises (a) a half-esterified oligomer which is the reaction product of an epoxy (meth) acrylate compound and an acid anhydride, at least part of which is an imide oligomer having acid anhydride groups at the ends, (b) a photopolymerization initiator and (c) a thermosetting resin. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2002226582A

公开(公告)日：2002-08-14

申请号：JP2001027780

申请日：2001-02-05

Applicant: UBE INDUSTRIES

Inventor： OZAWA HIDEO ,  AOKI FUMIO

IPC: C08K3/20 ,  C08G73/10 ,  C08L79/08 ,  D06M15/59

Abstract: PROBLEM TO BE SOLVED: To provide a water-soluble polyimide precursor capable of being applied to an aromatic polyimide and hardly causing the reduction of heat resistance (especially thermal degradation temperature) and mechanical properties (especially tensile strength and elongation), and further to provide an aqueous solution of the polyimide precursor, a method for producing the aqueous solution and the polyimide. SOLUTION: This powdery water-soluble polyimide precursor is obtained by reacting a polyimide precursor comprising a tetracarboxylic acid component and an aromatic diamine component with 1,2-dimethylimidazole and/or 1-methyl-2-ethylimidazole in an amount of >=0.7 molar time as much as the carboxy group of the polyimide precursor, and separating and collecting the product from the resultant mixture. The polyimide precursor solution is obtained by dissolving the water-soluble polyimide precursor in water. The method for producing the solution of the polyimide precursor comprises dissolving the water-soluble polyimide precursor in the water. The polyimide has the heat resistance nearly the same as that of the polyimide obtained by heating and imidizing the organic solvent solution of the polyimide precursor.

公开(公告)号：JPH06263873A

公开(公告)日：1994-09-20

申请号：JP5561393

申请日：1993-03-16

Applicant: UBE INDUSTRIES

Inventor： KIUCHI MASAYUKI ,  OZAWA HIDEO ,  ISHIKAWA SEIJI ,  NAKATANI MASAYUKI

IPC: C08G75/23 ,  C08G75/00

Abstract: PURPOSE:To obtain at good efficiency a polyether sulfone small in a content of residues such as solvent as unreacted monomer and having excellent properties by feeding a water-containing polyether sulfone to an extruder provided with a vacuum vent hole and melt-extruding the polymer. CONSTITUTION:The production process of the polyether sulfone comprises feeding a water-containing polyether sulfone to an extruder provided with a vacuum vent hole and melt-extruding the polymer. According to this process, residues such as solvent, unreacted monomer and oligomer can be removed at good efficiency from the polyether sulfone separated from the reaction solution, and therefore, a polyaryl ether sulfone less colored excellent in heat resistance and mechanical strengths can be produced.

公开(公告)号：JPH0253851A

公开(公告)日：1990-02-22

申请号：JP20460488

申请日：1988-08-19

Applicant: UBE INDUSTRIES

Inventor： NISHIYAMA MASAO ,  OTSUKI KAORU ,  OZAWA HIDEO

IPC: C08L67/02 ,  C08K5/15 ,  C08K5/1539 ,  C08L67/00 ,  C08L77/00

Abstract: PURPOSE:To obtain a polyamide resin composition useful as mechanical parts, etc., having low water absorption, excellent balance of mechanical strength and impact resistance by blending a polyamide resin with specific amounts of a polyester, tetracarboxylic acid dianhydride and modified styrene copolymer. CONSTITUTION:100 pts.wt. total amounts of (A) 5-95 pts.wt., preferably 15-85 pts.wt. polyamide resin (e.g., nylon 6 or nylon 66) having >=8,000 number-average molecular weight and (B) 95-5 pts.wt., preferably 85-15 pts.wt. polyester are blended with (C) 0.01-5 pts.wt., preferably 0.02-2 pts.wt. tetracarboxylic acid dianhydride (e.g., pyromellitic dianhydride) and (D) 1-40 pts.wt., preferably 5-25 pts.wt. modified styrene copolymer.

公开(公告)号：JPH11158276A

公开(公告)日：1999-06-15

申请号：JP32846097

申请日：1997-11-28

Applicant: UBE INDUSTRIES

Inventor： YAMAGUCHI HIROAKI ,  OZAWA HIDEO ,  WATAKABE HIDEJI

IPC: C08J5/18 ,  B29C41/12 ,  B29K77/00 ,  B29L7/00 ,  B32B15/08 ,  B32B27/34 ,  C08G73/10 ,  C08K3/10 ,  C08L79/08

Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide film excellent in adhesiveness by specifying its Al content and completing its thermal treatment. SOLUTION: The Al content of a film comprising arom. tetracarboxylic acid residues and arom. diamine residues is made to be 1-1,000 ppm, pref. 4-1,000 ppm. and the thermal treatment of the film is completed. The film can be produced by reacting an arom. tetracarboxylic dianhydride with an arom. diamine in an org. solvent, homogeneously dissolving an Al compd. (e.g. aluminum hydroxide) in the resulting polyamic acid soln., casting the resulting dope on a carrier, thermally drying and peeling thus formed film from the carrier, and subjecting the dry film to imidization under heating at 420 deg.C or higher for 2-30 min or by coating a self-supporting film obtd. from a polyamic acid soln. with a soln. contg. the Al compd., drying the coated film, and subjecting it to imidization as above-mentioned.

公开(公告)号：JPH10146932A

公开(公告)日：1998-06-02

申请号：JP30492696

申请日：1996-11-15

Applicant: UBE INDUSTRIES

Inventor： KIUCHI MASAYUKI ,  OZAWA HIDEO ,  KANATSUKI YUTAKA

IPC: B32B27/00 ,  B29C55/02 ,  B29K23/00 ,  B29L9/00 ,  B32B27/32 ,  C08L23/02 ,  C08L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a monolayer stretched film excellent in the uniformity of a heat shrinkage factor by a method wherein the film is obtained by separating a laminated stretched film excellent in flexibility, mechanical strength, heat resistance, heat shrinkability and oxygen gas barrier properties and the like. SOLUTION: This film is produced by laminating at least two layers or a layer A made of a thermoplastic resin having a hydrogen bond in a molecular chain and a layer B made of a polyolefin-based resin composition containing 20-100wt.% of an amorphous polyolefin having a propylene and/or butene-1 component of 50wt.% or more and 80-0wt.% of a crystalline polypropylene under the condition that the sum of the amorphous polyolefin and the crystalline polypropylene is 100wt.% and, in addition, at least one layer is one obtained by stretching the laminated film made of the layer B. Further, by separating the laminated stretched film, a monolayer stretched film made of the layer A is obtained.

公开(公告)号：JPH05156015A

公开(公告)日：1993-06-22

申请号：JP36040491

申请日：1991-12-06

Applicant: UBE INDUSTRIES

Inventor： KIUCHI MASAYUKI ,  OZAWA HIDEO ,  ONO TORU ,  ISHIKAWA SEIJI ,  JIBIKI HIROSHI

IPC: C08G75/00 ,  C08G75/20

Abstract: PURPOSE:To provide the subject resin excellent in long-term thermal stability. CONSTITUTION:The objective aromatic polysulfone resin is characterized by that it has >=1.8etaSP/C/Cn (Cn is the fraction of SO2 groups plus aliphatic groups in the number of the linking groups plus direct bonds between aromatic rings; etaSP/C is reduced viscosity). This resin, which has a specific constitution, causes no decline in its mechanical strength and tensile elongation at break even if exposed at elevated temperatures for a long time, therefore being highly excellent in thermal stability.

公开(公告)号：JPS63316056A

公开(公告)日：1988-12-23

申请号：JP15105887

申请日：1987-06-19

Applicant: UBE INDUSTRIES

Inventor： NISHIYAMA MASAO ,  OTSUKI KAORU ,  OZAWA HIDEO

IPC: G03G5/05

Abstract: PURPOSE:To enhance the adhesiveness between a conductive base and an electric charge generating layer and between the charge generating layer and charge transfer layer by specifying a binder resin which forms at least either of the charge generating layer and the charge transfer layer. CONSTITUTION:The resin obtd. by bringing a copolymer C of 1-19 ratio A/B by weight of a vinyl monomer A having an alicyclic hydrocarbon group and a vinyl monomer B having >=1 hydroxyl groups and a compd. D having >=2 isocyanate groups at 0.5-2.0 equiv. ratio (hydroxyl group)/(isocyanate group) of the hydroxyl group of the copolymer C and the isocyanate group of the compd. D is used as the binder resin which forms at least either of the charge generating layer and the charge transfer layer. The binder resin is preferably used in both the charge generating layer and the charge transfer layer. The adhesiveness between the conductive base and the charge generating layer as well as between said base and the charge transfer layer is thereby improved and since the solvent resistance is excellent, the durability is good.

公开(公告)号：JPH07316222A

公开(公告)日：1995-12-05

申请号：JP13938694

申请日：1994-05-30

Applicant: UBE REKISEN KK ,  UBE INDUSTRIES

Inventor： KIUCHI MASAYUKI ,  OZAWA HIDEO ,  KUBO TAKESHI ,  TAGA TAKEFUMI

IPC: C08J3/12 ,  B29B9/06 ,  C08F6/10 ,  C08F10/00

Abstract: PURPOSE:To obtain amorphous polyolefin resin granules improved in surface tack and hardly exhibiting blocking. CONSTITUTION:This granules comprise an amorphous polyolefin resin which has a content of insols. in boiling n-heptane of 10wt.% or lower and an endothermic peak (measured in the temp.-rise mode with a differential scanning calorimeter) of 2J/g or higher in the temp. range higher than its glass transition temperature.