公开(公告)号：JP2013023606A

公开(公告)日：2013-02-04

申请号：JP2011160679

申请日：2011-07-22

Applicant: Ube Industries Ltd ,  宇部興産株式会社

Inventor： TERADA TAKESHI ,  TAKABAYASHI SEIICHIRO ,  YAMASHITA HIROHISA

IPC: C08G73/10

Abstract: PROBLEM TO BE SOLVED: To provide a production method, by which polyimide fine particles comprising a specified chemical structure and having a uniform particle diameter, preferably polyimide fine particles having an average particle diameter of less than 2.0 μm and monomodal particle size distribution, can be stably and efficiently obtained with high reproducibility.SOLUTION: The method of producing polyimide particles, which include a tetracarboxylic acid component essentially comprising pyromellitic acids and a diamine component essentially comprising paraphenylene diamine, is characterized in that the tetracarboxylic acid component and the diamine component are subjected to polymerization-imidization reaction in a solvent containing water in a molar amount 0.1 to 5.0 times as much as the amount of the tetracarboxylic acid component to precipitate polyimide particles.

Abstract translation: 解决的问题为了提供一种制造方法，通过使具有规定的化学结构且粒径均匀的聚酰亚胺微粒优选平均粒径小于2.0μm的聚酰亚胺微粒和单峰粒径分布 ，可以以高再现性稳定有效地获得。 解决方案：包括基本上包含均苯四酸的四羧酸组分和基本上包含对苯二胺的二胺组分的聚酰亚胺颗粒的制造方法的特征在于，对四羧酸组分和二胺组分进行聚合 - 酰亚胺化反应 在含有摩尔量为四羧酸成分的量的0.1〜5.0倍的水的溶剂中沉淀聚酰亚胺粒子。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2001213924A

公开(公告)日：2001-08-07

申请号：JP2000025434

申请日：2000-02-02

Applicant: UBE INDUSTRIES ,  MEIWA KASEI KK

Inventor： HIRAYAMA SUKEAKI ,  TAKABAYASHI SEIICHIRO

IPC: C08G8/32 ,  C08G8/28 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat resistant, liquid phenol novolak resin excellent in flowability, moisture absorption resistance and heat resistance and to provide a product obtained therefrom. SOLUTION: The method for manufacturing a heat resistant, liquid phenol novolak resin comprises reacting 100 pts.wt. of a liquid phenolic resin having a structure represented by formula (1), wherein R1 is a 1-4C alkyl or an aryl group; R2 is -CH2-, formula (2) or formula (3); and n is an integer with 3-80 pts.wt. of at least one compound selected from the group consisting of aromatic tetracarboxylic acids, aromatic tetracarboxylic dianhydrides and derivatives thereof, and aromatic diamines. The product is derived from the resin.

公开(公告)号：JP2000290611A

公开(公告)日：2000-10-17

申请号：JP10119399

申请日：1999-04-08

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  SONOYAMA KENJI

IPC: H01L23/14 ,  B32B27/00 ,  C09J7/02 ,  C09J163/00 ,  C09J179/08 ,  H05K1/03 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To obtain a bonding sheet for a cover lay capable of satisfying adhesion, sufficient peel strength, solder heat and moisture resistances, embedding properties or the like at a relatively low temperature usable as a cover lay sheet of a printed circuit board. SOLUTION: This bonding sheet for a cover lay is obtained by providing an adhesive layer on a heat-resistant film, can be contact bonded at a temp. of =1,014 Ω.cm volume resistivity after curing, >=240 deg.C solder heat resistance, moisture resistance of >=10% retention ratio of peel strength after moisture resistance tests (after being kept at 121 deg.C and 100% humidity for 60 h), electrical reliability without forming dentrites in electrodes after electrical reliability tests (at 130 deg.C and 85% humidity under 2.3 atm pressure, 100 V applied voltage for 10,000 min with comb-shaped electrodes) and 100% embeddability in embedding tests (at 180 deg.C under 50 kg/cm2 pressure for 10 min).

公开(公告)号：JPH11255900A

公开(公告)日：1999-09-21

申请号：JP1411899

申请日：1999-01-22

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  MURAMATSU TADAO ,  FUNAKOSHI TSUTOMU ,  HIRANO TETSUHARU

IPC: C08L83/10 ,  C08G73/10 ,  C08G77/455 ,  C09J183/10

Abstract: PROBLEM TO BE SOLVED: To obtain a polyimidesiloxane which enables lamination of various metal foils and a heat-resistant supporting material at a relatively low temp., by employing a tetracarboxylic acid component and a diamine component composed of a diaminopolysiloxane and an arom. diamine. SOLUTION: This polyimidesiloxane has a logarithmic viscosity of 0.05-7 (at 0.5 g/100 ml in a solvent: N-methyl-2-pyrolidone and at 30 deg.C), an imidization rate of >=90% as measured by the infrared absorption spectrum analyzing method, and a softening point of 5-250 deg.C and an elastic modulus of 250 kg/mm or less, of a film formed by the cast method from an org. solvent soln. Sixty mol.% or more of the tetracarboxylic acid component is composed of 2,3,3',4'- biphenyltetracarboxylic aid dianhydride residue and the remaining part, another org. tetracarboxylic acid component residue. Ten to 80 mol.% of the diamine component is composed of a diaminopolysiloxane residue and the residual group, another org. diamine residue.

公开(公告)号：JPH11177195A

公开(公告)日：1999-07-02

申请号：JP33564097

申请日：1997-12-05

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  MURAMATSU TADAO ,  SONOYAMA KENJI

IPC: B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  H05K1/03 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To provide a flexible circuit board having heat resistance and low curl and a manufacturing method. SOLUTION: A flexible circuit board comprises a base layer made of a multi- layer aromatic polyimid film including a thin layer 3 and a metal layer 5 laminated thereon via a heat-resistant adhesive 4. In the case where the multi-layer aromatic polyimide film with the adhesive is employed, since the base layer 2 made of the multi-layer aromatic polyimide film and the thin layer 3 are strongly bonded together by the inter-diffusion and the thin layer 3 and the heat-resistant adhesive 4 are arranged on both sides of the base layer 2, the circuit board does not curl in the following processes where it is subjected to lamination of a metal foil or chemical etching.

公开(公告)号：JPH08283411A

公开(公告)日：1996-10-29

申请号：JP8903595

申请日：1995-04-14

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  HIRANO TETSUHARU

IPC: C08G73/10

Abstract: PURPOSE: To obtain a modified polyimide film having excellent chemical resistance, high adhesive strength and high dimensional accuracy while keeping excellent physical properties, heat-resistance, etc., at high levels by irradiating a surface of a polyimide film with an eximer laser. CONSTITUTION: A polyimide film having a tensile elastic modulus of >=400kg/mm , composed of a polymer consisting of (A) an aromatic tetracarboxylic acid component and (B) an aromatic diamine component, having a C/N polymerization ratio of 12-20 and containing 5-500ppm of P in the total film is produced by irradiating at least one surface of the film with an eximer laser. Preferably, the component A contains >=30mol% of biphenyltetracarboxylic acid component and the component B contains >=50mol% of phenylenediamine component.

公开(公告)号：JPH08276534A

公开(公告)日：1996-10-22

申请号：JP7876895

申请日：1995-04-04

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  MATSUBARA KENJI

IPC: B32B15/08 ,  B29C47/06 ,  B32B15/088 ,  C08G73/10 ,  C23C14/20 ,  H05K1/03

Abstract: PURPOSE: To strengthen adhesive power by improving heat resistance by a method wherein metal is vapor deposited and/or a metal plated layer is formed on an aromatic polyimide layer containing a bendable bond in a principal chain of a multi-layer extruded polyimide film. CONSTITUTION: A polyimide film with a metallic film 1 of three layers is composed of a multi-layer extruded polyimide film (base material film) 2 and a metallic film 3. For the multi-layer extruded polyimide film 2, for example, preferably a precursor solution of a high heat resisting aromatic polyimide and a precursor of an aromatic polyimide having a bendable bond in a principal chain are extruded by a multi-layer extruding method, and thereafter, the obtained laminate is dried at 50-200 deg.C, and heat treated at 300 deg.C or higher, preferably at 300-500 deg.C. The multi-layer aromatic polyimide film having the aromatic polyimide layer with bendable bond in the principal chain on the surface which is manufactured thus, is exemplified.

公开(公告)号：JPH08230101A

公开(公告)日：1996-09-10

申请号：JP4032895

申请日：1995-02-28

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  TANIOKA RIKIO

IPC: B32B15/08 ,  B32B15/088 ,  H05K1/03

Abstract: PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer extruded polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer extruded polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by integral lamination of a thermoplastic aromatic polyimide thin film on at least one side of a high temperature-resistant aromatic polyimide substrate layer, which is achieved by, for example, the multilayer extrusion of a substrate layer polyimide precursor solution together with a thin film polyimide solution or its precursor solution. The metal foil-laminated polyimide film 1 is formed by laying a metal foil 3 on the thermoplastic aromatic polyimide thin film of the multilayer extruded polyimide film 2 and then heating and pressuring them for lamination.

公开(公告)号：JPH06313055A

公开(公告)日：1994-11-08

申请号：JP13378693

申请日：1993-04-27

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  HIRANO TETSUHARU

IPC: C08G73/10 ,  C08J5/18 ,  C08J7/14 ,  C08L79/08 ,  H01L21/302 ,  H05K1/03 ,  H05K3/38 ,  H01L21/306

Abstract: PURPOSE:To prepare a polyimide film subjected to surface roughening treatment while keeping the excellent physical properties, heat resistance, etc., essential to an aromatic polyimide film to a high level, excellent in slippage and adhesion and, therefore, applicable, e.g. to a film for FPC or a base film for a double layer film. CONSTITUTION:This method is to produce a surface-roughened polyimide film by mixing the first aromatic polyamic acid solution prepared from a two benzene ring-containing aromatic tetracarboxylic acid component and an aromatic diamine component with the second aromatic polyamic acid solution prepared from a one benzene ring-containing aromatic tetracarboxylic acid component and an aromatic diamine component so that the weight ratio of the aromatic polyamic acids may be 9:1 to 6:4, casting the resultant mixture for formation of film, imidating it and treating the imidated film with an alkaline solution.

公开(公告)号：JPH05311143A

公开(公告)日：1993-11-22

申请号：JP16159892

申请日：1992-05-12

Applicant: UBE INDUSTRIES

Inventor： INOUE HIROSHI ,  TAKABAYASHI SEIICHIRO ,  FUNAKOSHI TSUTOMU ,  SONOYAMA KENJI

IPC: C09J7/00 ,  C09J7/02 ,  C09J163/00 ,  C09J179/08 ,  C09J183/00 ,  C09J183/04 ,  H05K3/38

Abstract: PURPOSE:To provide the adhesive having a specific composition, capable of easily bonding a metal foil to a heat-resistant film, etc., at a low temperature to give bonded and cured product having high adhesiveness even at a high temperature and, accordingly, suitable for the production of a flexible printed circuit board, etc. CONSTITUTION:The adhesive contains (A) 100 pts.wt. of a soluble polyimide siloxane produced by reacting an aromatic tetracarboxylic acid component composed mainly of a biphenyltetracarboxylic acid (preferably 2,3,3',4'- biphenyltetracarboxylic acid dianhydride) with 10-80mol% of a diaminopolysiloxane of formula (R is bivalent hydrocarbon group; R1 to R4 are lower alkyl or phenyl; n is 3-60) and 20-90mol% of an aromatic diamine (preferably 1,4-diaminodiphenyl ether, etc.), (B) 10-200 pts.wt. of a silicone compound derived from an epoxy-modified polysiloxane and a phenolic resin, (C) 15-250 pts.wt. of other epoxy compound and (D) an epoxy hardener as resin components.