公开(公告)号：JP2001116536A

公开(公告)日：2001-04-27

申请号：JP27723099

申请日：1999-09-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： JO SENRAI ,  RO CHUKAN ,  RO BUNSEN ,  SHU SHIKO

IPC: G01B15/00 ,  G01B11/16 ,  G01B11/24 ,  G01N23/04

Abstract: PROBLEM TO BE SOLVED: To provide a device and method for wafer boat deformation degree inspection. SOLUTION: A wafer boat to be inspected is provided. The wafer boat is fixed on a plane screen of a wafer boat deformation degree inspector, the internal image of the wafer boat is output by the wafer boat deformation degree inspector. The ignored failure is corrected and compensated, the internal image of the standard wafer boat and the internal image of the wafer boat are compared and the difference in dimension of the internal image of the standard wafer boat corresponding to the internal image of the wafer boat are analyzed and completed.