公开(公告)号：JP2001110778A

公开(公告)日：2001-04-20

申请号：JP28395699

申请日：1999-10-05

Applicant: UNITED MICROELECTRONICS CORP

Inventor： RO CHUKAN ,  RO BUNSEN ,  SHU SHIKO ,  RIN KOYO

IPC: H01L21/302 ,  H01L21/3065 ,  H01L21/68 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To provide a device for preventing plasma from etching a wafer clamp in a semiconductor process. SOLUTION: This device has a receiving base, a lower electrode, a wafer clamp, a semiconductor wafer, a quartz ring, an upper electrode, a cooling plate, an anodize, and a gas hole. The wafer clamp is used for tightly pinching the semiconductor wafer and has a clamp ring, a recessed holder, and a recessed portion, and the clamp ring is used for supporting the semiconductor wafer. The recessed holder has one semi-ellipsoidal surface in the clamp ring, and during a deposition process or an etching process, polymer is formed on the back of the recessed holder to prevent the wafer clamp from being etched by plasma. The recessed portion is arranged at a position higher than the neighboring recessed holder.

公开(公告)号：JP2001116536A

公开(公告)日：2001-04-27

申请号：JP27723099

申请日：1999-09-29

Applicant: UNITED MICROELECTRONICS CORP

Inventor： JO SENRAI ,  RO CHUKAN ,  RO BUNSEN ,  SHU SHIKO

IPC: G01B15/00 ,  G01B11/16 ,  G01B11/24 ,  G01N23/04

Abstract: PROBLEM TO BE SOLVED: To provide a device and method for wafer boat deformation degree inspection. SOLUTION: A wafer boat to be inspected is provided. The wafer boat is fixed on a plane screen of a wafer boat deformation degree inspector, the internal image of the wafer boat is output by the wafer boat deformation degree inspector. The ignored failure is corrected and compensated, the internal image of the standard wafer boat and the internal image of the wafer boat are compared and the difference in dimension of the internal image of the standard wafer boat corresponding to the internal image of the wafer boat are analyzed and completed.