公开(公告)号：JP2000198061A

公开(公告)日：2000-07-18

申请号：JP164299

申请日：1999-01-07

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  YO SHUKO ,  GO KONRIN ,  YU FUKUYO

IPC: B24B37/26 ,  B24D13/12 ,  B24D13/14 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To uniformly distribute the slurry to accelerate the polishing by designing a pattern of stream line grooves on a chemical mechanical polishing pad on the basis of a flow equation obtained from the blowout flow and the vortex flow. SOLUTION: The direction of a slurry flow includes the blowout flow and the vortex flow mentioned in an equation (I). In the equation I, Ψ is a stream line function, m is a strength parameter of blowout flow, k is a strength parameter of vortex flow, ln is a natural logarithm, and r, θ and z are coordinate parameters. A stream line groove function of an equation II is obtained on the basis of the equation I. In the equation II, exp is an exponential function, and C1 = constant = exp (Ψ/k). A designed pattern of the stream line grooves formed on a polishing pad for slurry is obtained on the basis of the equation I. The polishing pad is designed on the basis of the optimum result of the stream line groove pattern. By the stream line grooves, the direction of the slurry current can be optimized, and the slurry can be uniformly distributed under a polishing head. Whereby the polishing effect and the flatness can be effectively improved.