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    CHEMICAL MACHINE GRINDER AND MANUFACTURE OF HOLD RING USED IN THE GRINDER
    1.
    发明专利
    CHEMICAL MACHINE GRINDER AND MANUFACTURE OF HOLD RING USED IN THE GRINDER 失效

    公开(公告)号：JPH11226866A

    公开(公告)日：1999-08-24

    申请号：JP24621998

    申请日：1998-08-31

    Applicant: UNITED MICROELECTRONICS CORP

    Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  KYU UNBO ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

    IPC: B24B37/00 ,  B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  H01L21/304

    Abstract: PROBLEM TO BE SOLVED: To improve the smoothness by forming a plurality of slurry passages in a bottom fringe part of a hold ring and arranging the slurry passages at substantially equal interval. SOLUTION: A hold ring 40 is formed in such a way that it has a plurality of slurry passages, paths, namely, pipe passages 42. This slurry passage 42 can be formed as a lower groove of the hold ring 40, a groove or a pipe passage through the hold ring or a space having the other shape. For example, a plurality of straight grooves arranged at substantially equal interval around the hold ring 60 are formed. In this case, while grinding is done, the hold ring 40 rotates at a predetermined speed and these straight grooves 42 are directed in such a manner that they form an acute angle of attack for slurry supplied from the outside of the hold ring 40. For this reason, it is possible to circulate slurry smoothly on a surface of a wafer on an inner side of the hold ring 40 by supplying slurry through the hold ring 40 due to the assistance of the straight grooves 42.

    IN SITU SLURRY MIXING DEVICE
    2.
    发明专利
    IN SITU SLURRY MIXING DEVICE 失效

    公开(公告)号：JP2000202262A

    公开(公告)日：2000-07-25

    申请号：JP1060999

    申请日：1999-01-19

    Applicant: UNITED MICROELECTRONICS CORP

    Inventor： YO MEISEI ,  LAI CHIEN-HSIN ,  CHO KAZUI ,  WU JUAN-YUAN

    IPC: B24B57/02 ,  B01F5/00 ,  B01F5/06 ,  H01L21/304

    Abstract: PROBLEM TO BE SOLVED: To provide a in situ mixing device improved in the mixing degree of slurry and capable of uniformly mixing. SOLUTION: The device has plural 1st tubes 104 each having a 1st diameter and plural 2nd tubes 102 each having a 2nd diameter, and is composed of a cylindrical main body 105 structured by alternately linking the 2nd tubes 102 and the 1st tubes 104 to each other and plural tapered plugs 103, and each of plural tapered plugs 103 is positioned inside each 2nd tube 103 and the tip part of the plug 103 face to the direction opposed to the flowing direction of fluid flowing in the cylindrical main body 105.

    CHEMICAL MECHANICAL POLISHING PAD
    3.
    发明专利
    CHEMICAL MECHANICAL POLISHING PAD 失效

    公开(公告)号：JP2000198061A

    公开(公告)日：2000-07-18

    申请号：JP164299

    申请日：1999-01-07

    Applicant: UNITED MICROELECTRONICS CORP

    Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  YO SHUKO ,  GO KONRIN ,  YU FUKUYO

    IPC: B24B37/26 ,  B24D13/12 ,  B24D13/14 ,  H01L21/304 ,  B24B37/00

    Abstract: PROBLEM TO BE SOLVED: To uniformly distribute the slurry to accelerate the polishing by designing a pattern of stream line grooves on a chemical mechanical polishing pad on the basis of a flow equation obtained from the blowout flow and the vortex flow. SOLUTION: The direction of a slurry flow includes the blowout flow and the vortex flow mentioned in an equation (I). In the equation I, Ψ is a stream line function, m is a strength parameter of blowout flow, k is a strength parameter of vortex flow, ln is a natural logarithm, and r, θ and z are coordinate parameters. A stream line groove function of an equation II is obtained on the basis of the equation I. In the equation II, exp is an exponential function, and C1 = constant = exp (Ψ/k). A designed pattern of the stream line grooves formed on a polishing pad for slurry is obtained on the basis of the equation I. The polishing pad is designed on the basis of the optimum result of the stream line groove pattern. By the stream line grooves, the direction of the slurry current can be optimized, and the slurry can be uniformly distributed under a polishing head. Whereby the polishing effect and the flatness can be effectively improved.

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