公开(公告)号：AU2003204541B2

公开(公告)日：2005-07-07

申请号：AU2003204541

申请日：2003-06-05

Applicant: UNITED TECHNOLOGIES CORP

Inventor： ALAHYARI ABBAS A ,  BLAIR MICHAEL F ,  DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  F02C007/18 ,  F01P001/00 ,  F01D025/12 ,  F02C007/12

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：AU2003204541A1

公开(公告)日：2004-01-22

申请号：AU2003204541

申请日：2003-06-05

Applicant: UNITED TECHNOLOGIES CORP

Inventor： ALAHYARI ABBAS A ,  BLAIR MICHAEL F ,  DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  F01P1/00 ,  F02C7/12

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：CA2432490A1

公开(公告)日：2003-12-19

申请号：CA2432490

申请日：2003-06-16

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BLAIR MICHAEL F ,  ALAHYARI ABBAS A ,  DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  B21D53/00 ,  F28F7/00 ,  B23P15/00

Abstract: An embedded microcircuit for producing an improved cooling film over a surface of a part, comprising an inlet through which a coolant gas may enter, a circuit channel extending from the inlet through which the coolant gas may flow, and a slot film hole formed at a terminus of the circuit channel through which the coolant gas may exit a part.

公开(公告)号：SG125088A1

公开(公告)日：2006-09-29

申请号：SG200303390

申请日：2003-06-09

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID ,  BLAIR MICHAEL F ,  ALAHYARI ABBAS A

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/00 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.