公开(公告)号：DE60305100T2

公开(公告)日：2006-12-14

申请号：DE60305100

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F02C7/18 ,  F23M5/08 ,  F23R3/00 ,  F25D9/00 ,  F28D7/08

Abstract: A linked microcircuit (7) for providing coolant gas flow through an aircraft part, comprises at least one inlet through which a coolant gas may enter, a circuit channel (29) extending from the at least one inlet through which the coolant gas may flow. The circuit channel (29) is formed from the superimposition of a plurality of alternating serpentine circuits. At least one outlet (30) is appended to the circuit channel 29 through which the coolant gas may exit the circuit channel.

公开(公告)号：AT327415T

公开(公告)日：2006-06-15

申请号：AT03253895

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  H05K1/02

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：DE60305100D1

公开(公告)日：2006-06-14

申请号：DE60305100

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F02C7/18 ,  F23M5/08 ,  F23R3/00 ,  F25D9/00 ,  F28D7/08

Abstract: A linked microcircuit (7) for providing coolant gas flow through an aircraft part, comprises at least one inlet through which a coolant gas may enter, a circuit channel (29) extending from the at least one inlet through which the coolant gas may flow. The circuit channel (29) is formed from the superimposition of a plurality of alternating serpentine circuits. At least one outlet (30) is appended to the circuit channel 29 through which the coolant gas may exit the circuit channel.

公开(公告)号：AT325938T

公开(公告)日：2006-06-15

申请号：AT03253894

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F02C7/18 ,  F23M5/08 ,  F23R3/00 ,  F25D9/00 ,  F28D7/08

Abstract: A linked microcircuit (7) for providing coolant gas flow through an aircraft part, comprises at least one inlet through which a coolant gas may enter, a circuit channel (29) extending from the at least one inlet through which the coolant gas may flow. The circuit channel (29) is formed from the superimposition of a plurality of alternating serpentine circuits. At least one outlet (30) is appended to the circuit channel 29 through which the coolant gas may exit the circuit channel.

公开(公告)号：DE60305385T2

公开(公告)日：2007-03-29

申请号：DE60305385

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  F01D5/18 ,  B81B7/04 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  H05K1/02

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：DK1377140T3

公开(公告)日：2006-08-21

申请号：DK03253895

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: B81B7/04 ,  B81B1/00 ,  F01D9/02 ,  F01D5/18 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  H05K1/02

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：DK1375824T3

公开(公告)日：2006-06-26

申请号：DK03253894

申请日：2003-06-19

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F02C7/18 ,  F23M5/08 ,  F23R3/00 ,  F25D9/00 ,  F28D7/08

Abstract: A linked microcircuit (7) for providing coolant gas flow through an aircraft part, comprises at least one inlet through which a coolant gas may enter, a circuit channel (29) extending from the at least one inlet through which the coolant gas may flow. The circuit channel (29) is formed from the superimposition of a plurality of alternating serpentine circuits. At least one outlet (30) is appended to the circuit channel 29 through which the coolant gas may exit the circuit channel.

公开(公告)号：AU2003204541B2

公开(公告)日：2005-07-07

申请号：AU2003204541

申请日：2003-06-05

Applicant: UNITED TECHNOLOGIES CORP

Inventor： ALAHYARI ABBAS A ,  BLAIR MICHAEL F ,  DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  F02C007/18 ,  F01P001/00 ,  F01D025/12 ,  F02C007/12

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.

公开(公告)号：AU2003204539B2

公开(公告)日：2004-12-16

申请号：AU2003204539

申请日：2003-06-05

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DRAPER SAMUEL DAVID

IPC: F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F02C7/18 ,  F23M5/08 ,  F23R3/00 ,  F25D9/00 ,  F28D7/08 ,  F02C007/18 ,  F01P001/00 ,  F01D025/12 ,  F02C007/12

Abstract: A linked microcircuit (7) for providing coolant gas flow through an aircraft part, comprises at least one inlet through which a coolant gas may enter, a circuit channel (29) extending from the at least one inlet through which the coolant gas may flow. The circuit channel (29) is formed from the superimposition of a plurality of alternating serpentine circuits. At least one outlet (30) is appended to the circuit channel 29 through which the coolant gas may exit the circuit channel.

公开(公告)号：AU2003204541A1

公开(公告)日：2004-01-22

申请号：AU2003204541

申请日：2003-06-05

Applicant: UNITED TECHNOLOGIES CORP

Inventor： ALAHYARI ABBAS A ,  BLAIR MICHAEL F ,  DRAPER SAMUEL DAVID

IPC: B81B1/00 ,  B81B7/04 ,  F01D5/18 ,  F01D9/02 ,  F01D25/12 ,  F01D25/24 ,  F02C7/18 ,  F02C7/28 ,  F23M5/08 ,  F23R3/00 ,  F23R3/06 ,  F25D9/00 ,  F28F13/02 ,  F01P1/00 ,  F02C7/12

Abstract: An embedded microcircuit (5) for producing an improved cooling film over a surface of a part, comprises an inlet through which a coolant gas may enter, a circuit channel (29) extending from the inlet through which the coolant gas may flow, and a slot film hole (31) formed at a terminus of the circuit channel (29) through which the coolant gas may exit a part.