公开(公告)号：CA2944993C

公开(公告)日：2021-03-02

申请号：CA2944993

申请日：2014-04-09

Applicant: UNITED TECHNOLOGIES CORP

Inventor： RADCLIFF THOMAS D ,  MANTESE JOSEPH V ,  CULP SLADE R ,  ANNAPRAGADA SUBRAMANYARAVI

IPC: F25B9/14

Abstract: Embodiments are direc-ted to a heat pump element comprising: a thin-film polymer or ceramic material within a range of 0.1 microns - 100 mi-crons thickness, and electrodes coupled to both sides of the thin-film material to form an electroded active thin-film ma-terial, wherein the thin-film material is separated by, and in intimate contact with, a heat transfer fluid in channels within a range of 10 microns - 10 milli-meters thickness, in which the fluid is capable of being translated back and forth through the element by an im-posed pressure field.

公开(公告)号：EP3068994A4

公开(公告)日：2017-07-19

申请号：EP14862211

申请日：2014-11-14

Applicant: UNITED TECHNOLOGIES CORP

Inventor： SCHMIDT WAYDE R ,  CULP SLADE R

IPC: F02C7/00 ,  F01D25/00 ,  G01B21/32 ,  G01D11/30 ,  G01D21/00 ,  G01K1/14 ,  G01K7/02 ,  G01L19/16

CPC classification number: F01D17/085 ,  B22F3/1055 ,  B22F7/06 ,  B23K20/103 ,  B32B15/043 ,  B32B15/14 ,  B32B15/18 ,  B32B2603/00 ,  B32B2605/18 ,  B33Y10/00 ,  B33Y80/00 ,  B64D45/00 ,  B64D2045/0085 ,  F01D5/147 ,  F01D17/04 ,  F01D17/08 ,  F05D2220/32 ,  G01D11/30 ,  G01K1/14 ,  G01K7/02 ,  G01K2205/00 ,  G01L19/083 ,  G01L19/16 ,  G01M15/14 ,  Y02P10/295 ,  Y02T50/672

Abstract: One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.

Abstract translation: 本公开的一个示例性实施例涉及具有嵌入式传感器的多层壁结构的制品。 此外，多层壁结构和传感器结合在一起。