公开(公告)号：KR20180041681A

公开(公告)日：2018-04-24

申请号：KR20187005680

申请日：2015-08-14

Applicant: UNITED TECHNOLOGIES CORP

Inventor： MANTESE JOSEPH V ,  DING ZHONGFEN

IPC: F25B21/00 ,  C08F20/30 ,  C08F20/34 ,  C08G63/685 ,  C08G63/695 ,  C08G65/26 ,  C08G77/60

CPC classification number: F25B21/00 ,  F25B2321/001 ,  Y02B30/66

Abstract: 냉각시스템은액정엘라스토머또는엘라스토머폴리머매트릭스에함유된액상액정을갖는전열요소(12)를포함한다. 전극들(14, 16)의쌍이전열요소의반대표면들상에배치된다. 제1 열흐름경로(18)가전열요소및 열흡수원(17) 사이에배치된다. 제2 열흐름경로(22)가전열요소및 열방출원(20) 사이에배치된다. 또한시스템은전극들로의전류를제어하도록그리고열 에너지의전달을제1 열흐름경로를따라전열요소로부터열 흡수원으로또는제2 열흐름경로를따라열 방출원으로부터전열요소로선택적으로보내도록구성되는제어기(24)를포함한다.

公开(公告)号：CA2944993C

公开(公告)日：2021-03-02

申请号：CA2944993

申请日：2014-04-09

Applicant: UNITED TECHNOLOGIES CORP

Inventor： RADCLIFF THOMAS D ,  MANTESE JOSEPH V ,  CULP SLADE R ,  ANNAPRAGADA SUBRAMANYARAVI

IPC: F25B9/14

Abstract: Embodiments are direc-ted to a heat pump element comprising: a thin-film polymer or ceramic material within a range of 0.1 microns - 100 mi-crons thickness, and electrodes coupled to both sides of the thin-film material to form an electroded active thin-film ma-terial, wherein the thin-film material is separated by, and in intimate contact with, a heat transfer fluid in channels within a range of 10 microns - 10 milli-meters thickness, in which the fluid is capable of being translated back and forth through the element by an im-posed pressure field.

公开(公告)号：EP3097427A4

公开(公告)日：2017-02-22

申请号：EP15740668

申请日：2015-01-23

Applicant: UNITED TECHNOLOGIES CORP

Inventor： NARDI AARON T ,  MANTESE JOSEPH V ,  KLECKA MICHAEL A ,  VIENS DANIEL V

IPC: G01D11/24

CPC classification number: G06K19/07722 ,  G01D9/005 ,  G01D11/245 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A component may be self-monitoring having a sensor assembly located on a surface of a substrate and covered by an encapsulating layer additively manufactured over the sensor assembly and thereby bonded to the substrate. The sensor may be wireless, self-powered, and embedded into the substrate such that it is unobtrusive and may not limit the performance or function of the component.