公开(公告)号：US20210159142A1

公开(公告)日：2021-05-27

申请号：US17165892

申请日：2021-02-02

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG ,  Chien-Chen LIN ,  Kuan-Wen FONG

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L23/00

Abstract: A chip package structure includes a circuit structure, a redistribution structure, a heat conductive component, a chip, and a heat sink. The circuit structure includes a first circuit layer. The redistribution structure is disposed on the circuit structure and includes a second circuit layer, wherein the redistribution structure has an opening. The heat conductive component is disposed on the circuit structure and covered by the redistribution structure. The heat conductive component has a horizontal portion and a vertical portion. The horizontal portion extends toward the opening until it exceeds the opening. The vertical portion extends upward beyond the top surface of the redistribution structure from a part of the horizontal portion. The chip is disposed in the opening, and the bottom of the chip contacts the heat conductive component. The heat sink is disposed over the redistribution structure and the chip.

公开(公告)号：US20210020561A1

公开(公告)日：2021-01-21

申请号：US16579812

申请日：2019-09-23

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen LIN

IPC: H01L23/498 ,  H01L21/48

Abstract: A method of manufacturing circuit board structure includes forming a sacrificial layer having first openings on a substrate; forming a metal layer on the sacrificial layer; forming a patterned photoresist layer having second openings over the sacrificial layer, in which the second openings are connected to the first openings and expose a portion of the metal layer; forming a first circuit layer filling the second openings and the first openings; forming a first dielectric layer over the sacrificial layer and covering the metal layer, in which the first dielectric layer has third openings exposing the first circuit layer; forming a second circuit layer filling the third openings and covering a portion of the first dielectric layer; removing the substrate to expose the sacrificial layer, a portion of the metal layer and a portion of the first circuit layer; and removing the sacrificial layer and the metal layer.

公开(公告)号：US20220157687A1

公开(公告)日：2022-05-19

申请号：US17156848

申请日：2021-01-25

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chien-Chen LIN ,  Ho-Shing LEE

IPC: H01L23/367 ,  H01L23/538

Abstract: A circuit substrate has an open substrate, a heat-dissipation block, multiple high thermal conductivity members, a first dielectric layer, a second dielectric layer, multiple first heat conductive members, and multiple second heat conductive members. The heat-dissipation block is disposed in the open substrate. Multiple high thermal conductivity members are mounted through the heat-dissipation block. The first dielectric layer exposes a part of one of two surfaces of the heat-dissipation block. The second dielectric layer exposes a part of the other surface of the heat-dissipation block. The first heat conductive members are in contact with the heat-dissipation block exposed from the first dielectric layer. The second heat conductive members are in contact with the part of the heat-dissipation block exposed from the second dielectric layer. Therefore, heat can be transferred quickly via the heat-dissipation block and the high thermal conductivity members to improve heat-dissipating capacity of the circuit substrate.

公开(公告)号：US20220199513A1

公开(公告)日：2022-06-23

申请号：US17654405

申请日：2022-03-11

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hao CHEN ,  Chia-Lung LIN ,  Chien-Hsiang CHOU ,  Yi-Lin CHIANG ,  Chien-Chen LIN

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/06

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

公开(公告)号：US20210242123A1

公开(公告)日：2021-08-05

申请号：US17234826

申请日：2021-04-20

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen LIN

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11

Abstract: A method of manufacturing circuit board structure includes forming a sacrificial layer having first openings on a substrate; forming a metal layer on the sacrificial layer; forming a patterned photoresist layer having second openings over the sacrificial layer, in which the second openings are connected to the first openings and expose a portion of the metal layer; forming a first circuit layer filling the second openings and the first openings; forming a first dielectric layer over the sacrificial layer and covering the metal layer, in which the first dielectric layer has third openings exposing the first circuit layer; forming a second circuit layer filling the third openings and covering a portion of the first dielectric layer; removing the substrate to expose the sacrificial layer, a portion of the metal layer and a portion of the first circuit layer; and removing the sacrificial layer and the metal layer.

公开(公告)号：US20200029433A1

公开(公告)日：2020-01-23

申请号：US16121645

申请日：2018-09-05

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen LIN ,  Kuan-Wen FONG

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H05K3/40

Abstract: A substrate structure includes a first circuit structure, a second dielectric layer, and a second circuit structure. The first circuit structure includes a first layer and a second layer. The first layer includes a first dielectric layer and a first circuit layer embedded in the first dielectric layer. The second layer is disposed below the first layer and includes a second circuit layer electrically connected to the first circuit layer. The second dielectric layer is disposed on the first circuit structure and has a first opening exposing a portion of the first circuit layer. The melting point of the second dielectric layer is lower than that of the first dielectric layer. The second circuit structure is disposed on the second dielectric layer and has a second opening connected to the first opening. The second circuit structure includes a third circuit layer electrically connected to the first circuit layer.

公开(公告)号：US20210298184A1

公开(公告)日：2021-09-23

申请号：US17338709

申请日：2021-06-04

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen LIN

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/46

Abstract: A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.

公开(公告)号：US20210014975A1

公开(公告)日：2021-01-14

申请号：US16544936

申请日：2019-08-20

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen LIN

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/46

Abstract: A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.