公开(公告)号：US20230262900A1

公开(公告)日：2023-08-17

申请号：US18155708

申请日：2023-01-17

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hsien CHIEN ,  Hsin-Hung LEE ,  Hsuan-Yu LAI ,  Yu-Chung HSIEH ,  Hung-Pin YU

IPC: H05K1/18 ,  H01Q1/48 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01Q1/48 ,  H05K1/111 ,  H05K2201/10098

Abstract: A bare circuit board is provided, in which the bare circuit board includes a substrate, an antenna, a chip pad, a ground pattern and a trace. The substrate includes a surface. The antenna and the chip pad are formed on the substrate. The ground pattern is formed on the surface. The trace is formed on the surface and isn’t connected to the ground pattern. A measuring gap is formed between the trace and an edge of the ground pattern, and the trace includes a first end and a second end. The first end is electrically connected to the chip pad, whereas the second end is electrically connected to the antenna. The bare circuit board is adapted to transmit a signal. The width of the measuring gap is smaller than a quarter of an equivalent wavelength of the signal.