公开(公告)号：US20220139886A1

公开(公告)日：2022-05-05

申请号：US17125981

申请日：2020-12-17

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Chia-Hao CHANG ,  Tzu-Nien LEE

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting package includes an encapsulating member, a plurality of light-emitting components disposed in the encapsulating member, a plurality of first electrode pads, a plurality of second electrode pads, and a plurality of conductive connection structures. The encapsulating member has a first surface and a second surface opposite to each other. Each light-emitting component has a light-emitting surface exposed on the first surface. Both the first electrode pads and the second electrode pads are exposed on the second surface. A first bonding surface of each first electrode pad and a second bonding surface of each second electrode pad are both flush with the second surface. The light-emitting components disposed on the first electrode pads are electrically connected to the first electrode pads. The conductive connection structures passing through the encapsulating member are electrically connected to the light-emitting components and the second electrode pads.

公开(公告)号：US20220131054A1

公开(公告)日：2022-04-28

申请号：US17102458

申请日：2020-11-24

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Tzu-Nien LEE

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/56

Abstract: A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulating member. Each light-emitting component has a light-emitting surface, a back surface opposite to the light-emitting surface, and a plurality of pads disposed on the back surface. The light-emitting surface of each light-emitting component is exposed on the first surface and is flush with the first surface. The pads of each light-emitting component are exposed on the second surface. The circuit structure is disposed on the second surface and electrically connected to the pads.