公开(公告)号：FI106754B

公开(公告)日：2001-03-30

申请号：FI904050

申请日：1990-08-16

Applicant: VAISALA OYJ

Inventor： LEHTO ARI ,  LAHDENPERAE JUHA ,  KUISMA HEIKKI

IPC: H01L20060101 ,  H01L21/60 ,  H01L21/78 ,  H01L23/48

Abstract: This publication describes a contact-furnished pickup 1' with layer structure and a method for creating the contacting of the pickup. According to the invention, the contacts 5' are formed on the side surface 7 of the pickup by utilisation of laser-based metallisation technique, by vaporisation, or by utilisation of another suitable deposition technique. As a result of the new method of contacting, the size of the pickup 1' can be reduced and the pickup 1' can be connected to a circuit card by utilisation of surface mounting technique.