ELECTRON BEAM RESIST
    1.
    发明专利

    公开(公告)号:JPS55105244A

    公开(公告)日:1980-08-12

    申请号:JP1252279

    申请日:1979-02-06

    Abstract: PURPOSE:To enhance the sensitivity of an electron beam resist for forming a minute pattern by making up a specified straight chain decomposition type polymer or a copolymer thereof as a component of the resist with two constituents of high and low molecular regions. CONSTITUTION:A straight chain decomposition type polymer represented by the formula (where each of R1 and R2 is a group other than hydrogen atom), e.g. alpha- cyanoacrylate type polymer or a copolymer thereof as component of an electron beam resist is made up so that a high molecular region of about 200000-2 millions in average MW and a low molecular region of 20000 or less become 5-50wt%. By this resist composition low molecular chains are present among high molecular chain in a resist film, and the solubility of an electron beam-irradiated portion in a developer is increased, thereby raising an irradiated portion to unirradiated portion solubility ratio, that is, relative sensitivity.

    DEVELOPMENT METHOD OF ELECTRON BEAM RESIST

    公开(公告)号:JPS5453966A

    公开(公告)日:1979-04-27

    申请号:JP12065677

    申请日:1977-10-07

    Abstract: PURPOSE:To develop the resist taking the major component for the poly alpha cyanoacrylate, poly alpha carbamylacrylate, or the copolymer of the both expressed in a given generic equation with the development solution including water. CONSTITUTION:Since the electron beam resist of copolymer system is produced for water soluble component with the beam emission if the copolymer component is specified, excellent relief can easily be obtained by giving water to the development solution or adding the water cleaning process in the development process only. The resist film is formed by solving the poly alpha cyanoethyl-acrylate into cyclohexanone and electron beam is emitted after heat treatment. Then, it is immersed in the developing solution in which ethylacetate and methylisobuthylketone is 1:1 for 90 seconds at room temperature and development is made by immersing it in the liquid in which isopropanol and water are 3:1. The developed screen obtained can be discovered for any flaw with the magnification of 10 thousand and accurate line can be observed.

    DEVELOPING METHOD FOR ELECTRON BEAM RESIST

    公开(公告)号:JPS556341A

    公开(公告)日:1980-01-17

    申请号:JP7827978

    申请日:1978-06-28

    Abstract: PURPOSE:To enable formation of a pattern without any chap in the developed area, by stopping development of a resist, such as poly-alpha-cyanoacrylate after development by use of a specified mixed solution, or rinsing the resist with the solution. CONSTITUTION:A resist film formed on a substrate by using poly-alpha-cyanoacrylate or poly-alpha-amidoacrylate of the formula, or these copolymer is, after prebaking, irradiated by electron beams. The resist is developing with a solution, such as a mixture of ethyl acetate and methyl isobutyl ketone, and then, development stop or rinse is carried out with a solvent mixture consisting of an organic solvent incapable of dissolving the resist polymer, such as methyl isobutyl ketone and of an organic solvent capable of dissolving the resist polymer, such as ethyl cellosolve acetate in an amount of 2 to 30%.

    THERMAL DEVELOPMENT OF ELECTRON BEAM RESIST

    公开(公告)号:JPS5461531A

    公开(公告)日:1979-05-17

    申请号:JP12797077

    申请日:1977-10-25

    Abstract: PURPOSE:To sufficiently satisfy the sensitivity and resolution by heating a substrate in a constant temperature bath after a resist composed mainly of poly-alpha-cyanoacrylate with electron beams. CONSTITUTION:An electron beam resist, whcih is composed mainly of poly-alpha- cyanoacrylate of Formula (wherein: X stands for cyano or carbamyl; R stands for a lower class alkyl; and n stands for a positive integer), poly-alpha-carbamylacrylate, or their copolymer, is formed on a substrate in a thickness of 0.5 to 1.5 microns and is prebaked at a low temperature. After having been irradiated with an electron beam, the substrate is heated in a constant temperature bath at 140 to 180 deg.C for 5 to 60 minutes in accordance with the depth of the irradiated portion after development. The irradiated region is diffused by the heat treatment to leave a non-irradiated portion thereby to form a pattern.

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