公开(公告)号：FI119729B

公开(公告)日：2009-02-27

申请号：FI20065484

申请日：2006-07-07

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  NIEMISTOE JIRI

IPC: B81C3/00 ,  B81B20060101 ,  B81B7/02 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/18 ,  H01L25/16

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：FI20065484A0

公开(公告)日：2006-07-07

申请号：FI20065484

申请日：2006-07-07

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  NIEMISTOE JIRI

IPC: H05K20060101 ,  B81B20060101 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/18

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：FI20065484A

公开(公告)日：2007-09-06

申请号：FI20065484

申请日：2006-07-07

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  NIEMISTOE JIRI

IPC: B81B20060101 ,  B81C3/00 ,  B81B7/02 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/18 ,  H01L25/16

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.