公开(公告)号：JP2011022149A

公开(公告)日：2011-02-03

申请号：JP2010173006

申请日：2010-07-30

Applicant: Vti Technologies Oy ,  ヴェーテーイー テクノロジーズ オサケユキチュア

Inventor： KUISMA HEIKKI ,  LAHDENPERA JUHA ,  MUTIKAINEN RISTO

IPC: G01P15/125 ,  B81B3/00 ,  B81C1/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0013 ,  B81B2201/0235 ,  B81C1/0096 ,  B81C2201/112 ,  G01P15/08 ,  G01P15/0802

Abstract: PROBLEM TO BE SOLVED: To provide an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.
SOLUTION: This capacitive acceleration sensor includes a pair of electrodes composed of a movable electrode (4) and a stationary electrode (5), and, related to the pair of electrodes, an isolator protrusion (6) having a diamond-like DLC (Diamond-like Carbon) coating.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种改进的，更耐用的传感器结构，其耐受比过去结构更好的过载情况下的磨损。 解决方案：该电容式加速度传感器包括由可动电极（4）和固定电极（5）组成的一对电极，并且与该对电极相关联，具有菱形的隔离突起（6） DLC（类金刚石碳）涂层。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：WO2008077821A3

公开(公告)日：2008-11-13

申请号：PCT/EP2007063975

申请日：2007-12-14

Applicant: CONTINENTAL TEVES AG & CO OHG ,  VTI TECHNOLOGIES OY ,  HARTMANN BERNHARD ,  HILSER ROLAND ,  KUISMA HEIKKI ,  TORKKELI ALTTI

Inventor： HARTMANN BERNHARD ,  HILSER ROLAND ,  KUISMA HEIKKI ,  TORKKELI ALTTI

IPC: B81C1/00

CPC classification number: H01L23/055 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/00

Abstract: The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.

Abstract translation: 一种用于生产Verkapselungsmoduls和用于微机械组件的封装方法，所述电子制成的生坯的导电连接装置的半导体材料形成，其中，在形成所述电子连接的过程是指在半导体材料构成的基材，在其上elektronischen.Anschlüssmittel布置，其随后结果 嵌入与在形成电子连接的过程中，半导体材料的基础上，是指嵌入材料; 在其上经由被布置在至少一个岛状材料山，形成，它代表了半导体电极。 本发明另外涉及一种封装模块和具有经由至少一个和至少一个半导体电极以及在机动车辆中使用的微型机械装置。

公开(公告)号：EP1891450A4

公开(公告)日：2011-07-27

申请号：EP06764496

申请日：2006-06-13

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18

CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831 ,  Y10T29/49007

公开(公告)号：FI119729B

公开(公告)日：2009-02-27

申请号：FI20065484

申请日：2006-07-07

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  NIEMISTOE JIRI

IPC: B81C3/00 ,  B81B20060101 ,  B81B7/02 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/18 ,  H01L25/16

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：FI119527B

公开(公告)日：2008-12-15

申请号：FI20030338

申请日：2003-03-05

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  LAHDENPERAE JUHA ,  MUTIKAINEN RISTO

IPC: G01P15/125 ,  B81B3/00 ,  B81C1/00 ,  G01P15/08

Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode ( 4 ) and a stationary electrode ( 5 ), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.

公开(公告)号：FI119299B

公开(公告)日：2008-09-30

申请号：FI20055323

申请日：2005-06-17

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18 ,  H01L21/00

Abstract: The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.

公开(公告)号：DE102007060931A1

公开(公告)日：2008-08-28

申请号：DE102007060931

申请日：2007-12-14

Applicant: CONTINENTAL TEVES AG & CO OHG ,  VTI TECHNOLOGIES OY

Inventor： HILSER ROLAND ,  HARTMANN BERNHARD ,  TORKKELI ALTTI ,  KUISMA HEIKKI

IPC: H01L23/055 ,  B81C1/00

Abstract: The method involves generating a base of a semiconductor material during a process of the formation of an electronic connector unit e.g. through contact (2). The electronic connector unit is arranged on the base of the semiconductor material. An insulated material mound is formed on the base of the semiconductor material by a structuring and/or etching process during the process of the formation of the electronic connector unit, where the insulated material mound represents a semiconductor electrode (3). An independent claim is also included for an encapsulation module for encapsulating a micromechanical structure and/or micromechanical arrangement.

公开(公告)号：FI20055618A0

公开(公告)日：2005-11-23

申请号：FI20055618

申请日：2005-11-23

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: B81B20060101 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  B81B

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part (46), sealed by means of a cover part (24), (28), (33), (41), (47), (48), and an electronic circuit part (64), (74), suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：NO20054579A

公开(公告)日：2005-10-05

申请号：NO20054579

申请日：2005-10-05

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  LAHDENPERA JUHA ,  MUTIKAINEN RISTO

IPC: G01P15/08 ,  B81B3/00 ,  B81C1/00 ,  G01P15/125 ,  B81B7/00

CPC classification number: G01P15/125 ,  B81B3/0013 ,  B81B2201/0235 ,  B81C1/0096 ,  B81C2201/112 ,  G01P15/08 ,  G01P15/0802

公开(公告)号：FI20096201A0

公开(公告)日：2009-11-19

申请号：FI20096201

申请日：2009-11-19

Applicant: VALTION TEKNILLINEN ,  VTI TECHNOLOGIES OY

Inventor： JAAKKOLA ANTTI ,  KUISMA HEIKKI

IPC: H01P20090101

Abstract: The invention concerns a novel bulk acoustic wave (BAW) resonator design and method of manufacturing thereof The bulk acoustic wave resonator comprises a resonator portion, which is provided with at least one void having the form of a trench which forms a continuous closed path on the resonator portion. By manufacturing the void in the same processing step as the outer dimensions of the resonator portion, the effect of processing variations on the resonant frequency of the resonator can be reduced. By means of the invention, the accuracy of BAW resonators can be increased.