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公开(公告)号：US11654659B2
公开(公告)日：2023-05-23
申请号：US17248933
申请日：2021-02-12
Applicant: View, Inc. , Corning Incorporated
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
IPC: B32B17/10 , G02F1/153 , G02F1/155 , G02F1/1524 , B29C65/00
CPC classification number: B32B17/10807 , B32B17/1088 , B32B17/1099 , B32B17/10146 , B32B17/10302 , B32B17/10513 , G02F1/153 , G02F1/155 , G02F1/1533 , B29C66/006 , B29C66/0382 , B29C2793/0027 , G02F1/1524
Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
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Patent Agency Ranking
公开(公告)号：US11623433B2
公开(公告)日：2023-04-11
申请号：US16310164
申请日：2017-06-14
Applicant: View, Inc. , Corning Incorporated
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
IPC: B32B17/10 , G02F1/153 , G02F1/155 , G02F1/1524 , B29C65/00
Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
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公开(公告)号：US20220259096A1
公开(公告)日：2022-08-18
申请号：US17661526
申请日：2022-04-29
Applicant: View, Inc.
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
Abstract: Methods for protecting transparent electronically conductive layers on glass substrates are described herein. Methods include depositing a sacrificial coating during deposition of the transparent electronically conductive layer, before packing the glass substrate for storage or shipping, after unpacking glass substrates from a stack of glass substrates, and/or after a washing operation prior to fabricating an electrochromic stack on the transparent electronically conductive layer. Methods also include removing the sacrificial coating during a washing operation, during tempering, or prior to depositing an electrochromic stack by, e.g., heating the sacrificial coating or exposing the sacrificial coating to an inert plasma.
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公开(公告)号：US20190146295A1
公开(公告)日：2019-05-16
申请号：US16310164
申请日：2017-06-14
Applicant: View, Inc. , Corning Incorporated
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
IPC: G02F1/155 , G02F1/153 , G02F1/161 , G02F1/1523
Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
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公开(公告)号：US20210162719A1
公开(公告)日：2021-06-03
申请号：US17248933
申请日：2021-02-12
Applicant: View, Inc. , Corning Incorporated
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
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公开(公告)号：US20210163346A1
公开(公告)日：2021-06-03
申请号：US17248930
申请日：2021-02-12
Applicant: View, Inc.
Inventor： Ronald M. Parker , Anshu A. Pradhan , Abhishek Anant Dixit , Douglas Dauson
Abstract: Methods for protecting transparent electronically conductive layers on glass substrates are described herein. Methods include depositing a sacrificial coating during deposition of the transparent electronically conductive layer, before packing the glass substrate for storage or shipping, after unpacking glass substrates from a stack of glass substrates, and/or after a washing operation prior to fabricating an electrochromic stack on the transparent electronically conductive layer. Methods also include removing the sacrificial coating during a washing operation, during tempering, or prior to depositing an electrochromic stack by, e.g., heating the sacrificial coating or exposing the sacrificial coating to an inert plasma.
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