公开(公告)号：WO2009105110A1

公开(公告)日：2009-08-27

申请号：PCT/US2008/054648

申请日：2008-02-22

Applicant: VISHAY INTERTECHNOLOGY, INC. ,  SZWARC, Joseph, ,  MAZLIAH, Dany ,  SATO, Makio, ,  OKAMOTO, Toru

Inventor： SZWARC, Joseph, ,  MAZLIAH, Dany ,  SATO, Makio, ,  OKAMOTO, Toru

IPC: H01C1/14 ,  H01C1/144 ,  H01C17/28

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor (30) having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad (32) and a second electrically conductive termination pad (32), both termination pads (32) on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead (4), each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead (4) attached and electrically connected to the first electrically conductive termination pad and the second flexible lead (4) attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads (4) has a plurality of lead sections (12, 14, 16) facilitating bending around the end of the chip resistor (30).

Abstract translation: 具有第一和第二相对端的芯片电阻器（30）包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘（32）和第二导电终端焊盘（32），两个端接焊盘 （32），在所述刚性绝缘基板的顶表面上，在所述第一和第二导电终端焊盘之间的电阻材料层以及由具有焊料的导电金属制成的第一和第二柔性引线（4） 增强涂层。 附接并电连接到第一导电终端焊盘和第二柔性引线（4）的第一柔性引线（4）连接并电连接到第二导电终端焊盘。 每个柔性引线（4）具有多个引线部分（12,14,16），其有助于在芯片电阻器（30）的端部附近弯曲。

公开(公告)号：EP2281291A1

公开(公告)日：2011-02-09

申请号：EP08730452.3

申请日：2008-02-22

Applicant: Vishay Intertechnology Inc.

Inventor： SZWARC, Joseph, ,  MAZLIAH, Dany ,  SATO, Makio, ,  OKAMOTO, Toru

IPC: H01C1/14 ,  H01C1/144 ,  H01C17/28

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor (30) having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad (32) and a second electrically conductive termination pad (32), both termination pads (32) on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead (4), each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead (4) attached and electrically connected to the first electrically conductive termination pad and the second flexible lead (4) attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads (4) has a plurality of lead sections (12, 14, 16) facilitating bending around the end of the chip resistor (30).