公开(公告)号：EP0773309A1

公开(公告)日：1997-05-14

申请号：EP96109878.7

申请日：1996-06-19

Applicant: WESTAIM TECHNOLOGIES INC.

Inventor： Djokic, Stojan ,  Lepard, Ros ,  Roy, Robert

IPC: C23C18/18

CPC classification number: C23C18/1893 ,  C23C18/1865 ,  H05K1/0306 ,  H05K3/181 ,  H05K3/244 ,  H05K3/381

Abstract: An improved process for the preparation of metallized ceramic substrates having a metal layer ranging from ten to two hundred microns in thickness, and having enhanced adhesion strength is provided. The process involves, in combination, a novel method for conditioning the ceramic substrate and the application of a thin intermediate layer of electrolessly and optionally, electrolytically, deposited metal prior to electrolytic metal deposition of an outer metallized layer.

Abstract translation: 提供了一种用于制备金属层厚度为10至200微米并且具有增强的粘合强度的金属化陶瓷基底的改进方法。 该方法组合地涉及一种用于调节陶瓷衬底的新方法和在电镀金属沉积外金属化层之前施加无电解和任选的电解沉积金属的薄中间层。