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    Microcircuit modular package
    1.
    发明授权
    Microcircuit modular package 失效
    MICROCIRCUIT模块化包装

    公开(公告)号：US3683105A

    公开(公告)日：1972-08-08

    申请号：US3683105D

    申请日：1970-10-13

    Applicant: WESTINGHOUSE ELECTRIC CORP

    Inventor： SHAMASH MAURICE B ,  STALEY WILLIAM W ,  DENTON CHARLES I ,  WALTON FRED D

    IPC: H05K1/14 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H05K3/361 ,  H05K1/141 ,  H05K3/28 ,  H05K3/328 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49128

    Abstract: Method and apparatus whereby the interconnection of integrated circuit chips is obtained by means of multilayers of microcircuit conductors fabricated on at least one flexible dielectric film. Metallized conductors are fabricated and selectively connected on both sides of the film by means of metallized throughholes. One or more integrated circuit chips are bonded and interconnected to the flexible film and the sub-assembly is then bonded and interconnected to a ceramic substrate sub-assembly which also contains appropriate metallized conductors thereon. The substrate additionally includes an insulating dielectric layer intermediate the opposing metallizations between the substrate and the lower surface of the flexible dielectric film and includes selected windows fabricated therein so that appropriate interconnection between the substrate conductors and the flexible film conductors can be accomplished by thermocompression bonding while at the same time preventing undesired shorting between opposing metallizations. The integrated chip may be mounted on either face of the flexible dielectric film or when desirable bonded to the substrate.

    Abstract translation: 通过在至少一个柔性电介质膜上制造的微电路导体的多层来获得集成电路芯片的互连的方法和装置。 金属化导体通过金属化通孔制造并选择性地连接在膜的两侧。 一个或多个集成电路芯片被接合并互连到柔性膜，然后将子组件接合并互连到陶瓷衬底子组件，陶瓷衬底子组件也包含适当的金属化导体。 衬底还包括在衬底和柔性介电膜的下表面之间的相对金属化层之间的绝缘电介质层，并且包括在其中制造的选定窗口，使得可以通过热压粘合来实现衬底导体和柔性膜导体之间的适当互连， 同时防止相对的金属化之间的不期望的短路。 集成芯片可以安装在柔性电介质膜的任一面上，或者当需要粘合到基板上时。

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