公开(公告)号：EP0607680A3

公开(公告)日：1994-12-21

申请号：EP93310107.3

申请日：1993-12-15

Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION

Inventor： Guckel, Henry ,  Christenson,Todd R. ,  Skrobis, Kenneth

IPC: G03F7/00 ,  G03F7/38 ,  G03F7/039 ,  G03F7/095 ,  G03F7/16

CPC classification number: G03F7/38 ,  B81C1/0038 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  G03F7/00 ,  G03F7/0035 ,  Y10S430/168 ,  Y10T428/31504

Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

公开(公告)号：EP0607680B1

公开(公告)日：1998-11-04

申请号：EP93310107.3

申请日：1993-12-15

Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION

Inventor： Guckel, Henry ,  Christenson,Todd R. ,  Skrobis, Kenneth

IPC: G03F7/00 ,  G03F7/38 ,  G03F7/039 ,  G03F7/095 ,  G03F7/16

CPC classification number: G03F7/38 ,  B81C1/0038 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  G03F7/00 ,  G03F7/0035 ,  Y10S430/168 ,  Y10T428/31504

公开(公告)号：EP0607680A2

公开(公告)日：1994-07-27

申请号：EP93310107.3

申请日：1993-12-15

Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION

Inventor： Guckel, Henry ,  Christenson,Todd R. ,  Skrobis, Kenneth

IPC: G03F7/00 ,  G03F7/38 ,  G03F7/039 ,  G03F7/095 ,  G03F7/16

CPC classification number: G03F7/38 ,  B81C1/0038 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  G03F7/00 ,  G03F7/0035 ,  Y10S430/168 ,  Y10T428/31504

Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

Abstract translation: 在形成微结构的，光致抗蚀剂的预成型片，：诸如聚甲基丙烯酸甲酯（PMMA），其全部是无应变，可能之前或附着到基材的厚度期望之后被研磨下来。 光致抗蚀剂通过暴露通过掩模辐射,:诸如X射线图案化，并且使用显影剂以去除已经呈现易受显影剂中的光致抗蚀剂材料显影。 微量金属结构可以通过电镀金属成从光致抗蚀剂已被除去的区域形成。 光致抗蚀剂本身可形成有用的微结构，并且可以从基片通过利用基板和预成型片材可以由去除不影响光致抗蚀剂被去除之间的释放层被除去。 图案的光刻胶的多层可建立以允许形成复杂的三维微结构。