公开(公告)号：WO2010006065A3

公开(公告)日：2010-05-06

申请号：PCT/US2009049959

申请日：2009-07-08

Applicant: WISPRY INC ,  MORRIS ARTHUR S III ,  SUN LI ,  BAYTAN NORITO

Inventor： MORRIS ARTHUR S III ,  SUN LI ,  BAYTAN NORITO

IPC: B81B7/00 ,  B81B7/02

CPC classification number: B81C1/00333 ,  B81C2203/0145

Abstract: Thin film encapsulation devices and methods for MEMS devices and packaging are provided. For a MEMS device encapsulated by a sacrificial layer, a lid layer can be deposited over the MEMS device without touching the MEMS device. The lid layer can be patterned and etched with a distribution of release etch holes, which provide access to the sacrificial layer encapsulating the MEMS device. The sacrificial material can be removed through the release etch holes, and the release etch holes can be filled with a seal layer. The seal layer can be removed from the substrate except where it seals the etch holes, leaving a series of plugs that can prevent other materials from entering the MEMS device cavity. In addition, a seal metal layer can be deposited and patterned so that it covers and encloses the plugged etch holes, and a barrier layer can cover the entire encapsulation structure.

Abstract translation: 提供了用于MEMS器件和封装的薄膜封装装置和方法。 对于由牺牲层封装的MEMS器件，盖层可以沉积在MEMS器件上而不接触MEMS器件。 盖层可以通过释放蚀刻孔的分布来图案化和蚀刻，这释放蚀刻孔提供了对封装MEMS器件的牺牲层的访问。 可以通过释放蚀刻孔移除牺牲材料，并且释放蚀刻孔可以用密封层填充。 除了密封蚀刻孔的地方以外，密封层可以从衬底上去除，留下一系列可以防止其他材料进入MEMS器件腔的塞子。 另外，可以沉积并图案化密封金属层，使得其覆盖和封闭堵塞的蚀刻孔，并且阻挡层可以覆盖整个封装结构。

公开(公告)号：EP2898519A4

公开(公告)日：2016-06-01

申请号：EP13839408

申请日：2013-09-20

Applicant: WISPRY INC

Inventor： MORRIS ARTHUR S ,  DEREUS DANA ,  BAYTAN NORITO

IPC: H01G5/16

CPC classification number: H01G5/16 ,  B81B3/0008 ,  B81B3/0016 ,  B81B3/0051 ,  B81B2201/0221 ,  B81C1/00166 ,  B81C1/00476 ,  B81C2201/0109 ,  B81C2201/013 ,  H01G5/18 ,  H01G7/00

Abstract: Systems, devices, and methods for micro-electro-mechanical system (MEMS) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode. At least a portion of the movable capacitive electrode can be spaced apart from the fixed capacitive electrode by a first gap, and the movable actuation electrode can be spaced apart from the fixed actuation electrode by a second gap that is larger than the first gap.