Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
Abstract:
According to one aspect, the subject matter described herein includes a MEMS fixed capacitor and a method for fabricating the MEMS fixed capacitor. The MEMS fixed capacitor can include a first stationary, capacitive plate on a substrate. Further, the MEMS fixed capacitor can include a non-conductive, stationary beam suspended above the substrate. The MEMS fixed capacitor can also include a second stationary, capacitive plate spaced a predetermined distance from the first stationary, capacitive plate for producing a predetermined capacitance between the capacitive plates.
Abstract:
Substrates with slotted metals and related methods are provided. According to one aspect, a slotted metal attached to a substrate can include a metal patterned with slots less than or about equal to 2 microns. The slots can result in line widths that are approximately the size of a single metallurgical grain in an unpatterned layer.
Abstract:
Substrates with slotted metals and related methods are provided. According to one aspect, a slotted metal attached to a substrate can include a metal patterned with slots less than or about equal to 2 microns. The slots can result in line widths that are approximately the size of a single metallurgical grain in an unpatterned layer.
Abstract:
Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where each of the one or more actuation electrode being independently controllable, and a movable component spaced apart from the first surface and movable with respect to the first surface. Where the movable component further includes one or more movable actuation electrodes spaced apart from the plurality of fixed actuation electrodes.