公开(公告)号：JP2001165959A

公开(公告)日：2001-06-22

申请号：JP2000321533

申请日：2000-10-20

Applicant: XEROX CORP

Inventor： KIM PATRICK G ,  SMITH DONALD L ,  ALIMONDA ANDREW S

IPC: G01R1/067 ,  G01R1/073 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide an elastic contact containing a free part having a tip end. SOLUTION: This free part 162 of an elastic contact 160 has a contact surface 172 and a side surface 170. An abrasion resistant material 178 is formed in a part of the free part 162. This abrasion resistant material 178 can enhance the abrasion resistance of the elastic contact 160. This elastic contact 160 can be used for the probe.

公开(公告)号：JP2001230041A

公开(公告)日：2001-08-24

申请号：JP2000372324

申请日：2000-12-07

Applicant: XEROX CORP

Inventor： CHRISTOPHER L CHUA ,  FORK DAVID K ,  KIM PATRICK G ,  ROMANO LINDA

IPC: G01R1/06 ,  H01L21/56 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01R4/04 ,  H01R12/52 ,  H01R43/02 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a bonding technique enabling ultramicro processing with improved thermal shock proof and mechanical shock proof. SOLUTION: The method comprises a step for forming a first device having first contact structure furnished with at least one spring contact 15, a step for forming a second device 21 having a second contact structure, a step for applying an adhesive on at least either the first or the second device 14, 21, a step for aligning the first and the second devices 14, 21, a process for aligning the first and the second devices 14, 21 close enough with each other so that the first and the second contact structures are interconnected and the adhesive surrounds at least part of the contact structures, and a step for curing the adhesive. It is a method of interconnecting the two devices, where the step for applying the adhesive is done before the step of bringing the first and the second devices 14,21 into sufficient proximity with each other.