公开(公告)号：JP2001230041A

公开(公告)日：2001-08-24

申请号：JP2000372324

申请日：2000-12-07

Applicant: XEROX CORP

Inventor： CHRISTOPHER L CHUA ,  FORK DAVID K ,  KIM PATRICK G ,  ROMANO LINDA

IPC: G01R1/06 ,  H01L21/56 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01R4/04 ,  H01R12/52 ,  H01R43/02 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a bonding technique enabling ultramicro processing with improved thermal shock proof and mechanical shock proof. SOLUTION: The method comprises a step for forming a first device having first contact structure furnished with at least one spring contact 15, a step for forming a second device 21 having a second contact structure, a step for applying an adhesive on at least either the first or the second device 14, 21, a step for aligning the first and the second devices 14, 21, a process for aligning the first and the second devices 14, 21 close enough with each other so that the first and the second contact structures are interconnected and the adhesive surrounds at least part of the contact structures, and a step for curing the adhesive. It is a method of interconnecting the two devices, where the step for applying the adhesive is done before the step of bringing the first and the second devices 14,21 into sufficient proximity with each other.