公开(公告)号：BRPI0401840A

公开(公告)日：2005-03-08

申请号：BRPI0401840

申请日：2004-05-27

Applicant: XEROX CORP

Inventor： ANDREWS JOHN R ,  GERNER BRADLEY J ,  SCHMACHTENBERG RICHARD III ,  SLENES CHAD ,  SCHULTZ SAMUEL V

IPC: H05K3/32 ,  H01L21/60 ,  H01L21/68 ,  H05K1/14 ,  H05K3/12 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

Abstract: The structure has an adhesive standoff layer attached to a liner layer. Standoff apertures (63) are formed in the liner layer and the adhesive standoff layer. A mask adhesive layer is attached to the liner layer. A mask liner layer (75) is attached to the mask adhesive layer. Mask apertures are formed in the mask adhesive layer and the mask liner layer in alignment with the standoff apertures. Independent claims are also included for the following: (a) a method of making a standoff/mask structure (b) a method of making an interconnected electrical circuit structure.

公开(公告)号：JP2004356630A

公开(公告)日：2004-12-16

申请号：JP2004156449

申请日：2004-05-26

Applicant: Xerox Corp ,  ゼロックス コーポレイションXerox Corporation

Inventor： ANDREWS JOHN R ,  GERNER BRADLEY J ,  SCHMACHTENBERG RICHARD III ,  SLENES CHAD ,  SCHULTZ SAMUEL V

IPC: H05K3/32 ,  H01L21/60 ,  H01L21/68 ,  H05K1/14 ,  H05K3/12 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/1225 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13309 ,  H01L2224/16013 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27438 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3484 ,  H05K3/361 ,  H05K2201/2036 ,  H05K2203/0537 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/24843 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/07025

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable and efficient mechanical and electrical interconnection for a circuit structure. SOLUTION: The multilayer mating stand-off/mask structure comprises a mating standoff with multiple mating standoff apertures, and a mask with multiple mask apertures which are aligned with the standoff apertures. The mating stand-off/mask structure is equipped with a liner layer, adhesives mating standoff layer attached to this liner layer, multiple mating standoff apertures formed in the liner layer and the adhesives mating stand-off layer, mask adhesives layer attached to the liner layer, mask layer attached to this mask adhesives layer, and multiple mask apertures formed in the mask adhesives layer and the mask layer whose positions are adjusted to the multiple mating stand-off apertures. COPYRIGHT: (C)2005,JPO&NCIPI