TWO-DIMENSIONAL MICRO-MIRROR ARRAY ENHANCEMENTS
    4.
    发明申请
    TWO-DIMENSIONAL MICRO-MIRROR ARRAY ENHANCEMENTS 审中-公开
    二维微镜阵列增强

    公开(公告)号:WO0161400A3

    公开(公告)日:2003-07-10

    申请号:PCT/US0105309

    申请日:2001-02-16

    CPC classification number: G02B26/085 G02B26/0841

    Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. Torsion sensors (244) are provided along the axes of rotation to control deflection of the quadrant deflection electrodes. The shielded sensor structure (240) includes a silicon layer (241), an insulating layer (242) and a metal layer (243). The structure further includes a sensor implant resistor (244) in the silicon layer (241) and a shield (245) that is applied over the sensor implant resistor (244) to stabilise sensor output and eliminate light sensitivity.

    Abstract translation: 提出了具有多个具有改进的偏转和其它特性的二维微镜结构的微镜条组件。 在微镜结构中,用于静电偏转的电极设置在被加工,附接或模制成基底的锥形或准圆锥形实体上。 扭转传感器(244)沿旋转轴提供以控制象限偏转电极的偏转。 屏蔽传感器结构(240)包括硅层(241),绝缘层(242)和金属层(243)。 该结构还包括在硅层(241)中的传感器注入电阻器(244)和施加在传感器注入电阻器(244)上方以稳定传感器输出并消除光敏感的屏蔽件(245)。

    WAFER BONDING TECHNIQUES TO MINIMIZE BUILT-IN STRESS OF SILICON MICROSTRUCTURES AND MICRO-MIRRORS
    5.
    发明申请
    WAFER BONDING TECHNIQUES TO MINIMIZE BUILT-IN STRESS OF SILICON MICROSTRUCTURES AND MICRO-MIRRORS 审中-公开
    最小化硅微结构和微镜的内置应力的波形焊接技术

    公开(公告)号:WO0154176A9

    公开(公告)日:2003-01-16

    申请号:PCT/US0101758

    申请日:2001-01-18

    Inventor: SLATER TIMOTHY G

    CPC classification number: H01L21/2007 H01L21/76251

    Abstract: A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.

    Abstract translation: 用于微镜结构的接合晶片制造机构提供了在蚀刻之前,在器件晶片和处理晶片之间氧化器件晶片而不是处理晶片或分裂热氧化处理。 根据这种机制制造的微镜结构中的反射镜的平面度显着提高。

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