公开(公告)号：US20240351865A1

公开(公告)日：2024-10-24

申请号：US18622059

申请日：2024-03-29

Applicant: Xintec Inc.

Inventor： Jiun-Yen LAI ,  Wei-Luen SUEN ,  Ming-Chung CHUNG ,  Chih-Wei LIU

IPC: B81C1/00

CPC classification number: B81C1/00825 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2201/0146 ,  B81C2201/0159

Abstract: A manufacturing method of a micro electro mechanical system (MEMS) device includes forming a buffer protection layer on a semiconductor structure, wherein the semiconductor structure includes a wafer, a MEMS membrane, and an isolation layer between the wafer and the MEMS membrane, and the buffer protection layer is located in a slit of the MEMS membrane and on a surface of the MEMS membrane facing away from the isolation layer; etching the wafer to form a cavity such that a portion of the isolation layer is exposed though the cavity; etching the portion of the isolation layer; and removing the buffer protection layer.