公开(公告)号：US20110316119A1

公开(公告)日：2011-12-29

申请号：US13168111

申请日：2011-06-24

Applicant: Yong-hoon KIM ,  Yeong-jun Cho ,  Ji-hyun Lee ,  Hee-seok Lee

Inventor： Yong-hoon KIM ,  Yeong-jun Cho ,  Ji-hyun Lee ,  Hee-seok Lee

IPC: H01L23/485

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/228 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1902 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided is a semiconductor package including a de-coupling capacitor. The semiconductor package includes a substrate, on an upper surface of which a semiconductor chip is mounted; a plurality of first conductive bumps that are disposed on a lower surface of the substrate and that electrically connect the substrate to an external device; and a de-coupling capacitor that is disposed on the lower surface of the substrate and includes an electrode portion and at least one dielectric layer, wherein the electrode portion of the de-coupling capacitor includes second conductive bumps that electrically connect the substrate to an external device.

Abstract translation: 提供了包括去耦电容器的半导体封装。 半导体封装包括：衬底，其上表面安装有半导体芯片; 多个第一导电凸块，其设置在所述基板的下表面上，并将所述基板电连接到外部装置; 以及解耦电容器，其设置在所述基板的下表面上并且包括电极部分和至少一个电介质层，其中所述解耦电容器的电极部分包括将所述基板电连接到外部的第二导电凸块 设备。

公开(公告)号：US20110317381A1

公开(公告)日：2011-12-29

申请号：US13113239

申请日：2011-05-23

Applicant: Yong-hoon KIM ,  Hee-seok LEE

Inventor： Yong-hoon KIM ,  Hee-seok LEE

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board.

Abstract translation: 嵌入式芯片芯片封装包括具有凹入的半导体芯片安装单元的印刷电路板，嵌入在凹陷半导体芯片安装单元中的第一半导体芯片以及安装在第一半导体芯片和印刷电路板上的第二半导体芯片 。

公开(公告)号：US20130168871A1

公开(公告)日：2013-07-04

申请号：US13604301

申请日：2012-09-05

Applicant: Yong-hoon KIM ,  Hyo-soon KANG ,  Jin-kyung KIM

Inventor： Yong-hoon KIM ,  Hyo-soon KANG ,  Jin-kyung KIM

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/06155 ,  H01L2224/06181 ,  H01L2224/1301 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/14361 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor package of a package on package structure reducing an overall thickness of the package and simplifying design complexity of wiring paths is provided. The package includes a first package including a first substrate and a first semiconductor chip portion mounted thereon, a second package disposed on the first package and including a second substrate and a second semiconductor chip portion mounted thereon, and a connection member connecting the first and second substrates. The second semiconductor chip portion includes at least one semiconductor chip including a group of chip pads corresponding to one channel, and the group of chip pads is concentrated on a first edge of the semiconductor chip. An intellectual property core corresponding to the one channel is formed on an edge of the first semiconductor chip portion and the IP core corresponds to the edge on which the group of chip pads is concentrated.

Abstract translation: 提供了一种封装结构封装的半导体封装，减少了封装的整体厚度，并简化了布线路径的设计复杂性。 所述封装包括：第一封装，包括第一基板和安装在其上的第一半导体芯片部分;第二封装，设置在所述第一封装上，并且包括第二基板和安装在其上的第二半导体芯片部分;以及连接部件， 底物。 第二半导体芯片部分包括至少一个半导体芯片，其包括对应于一个通道的一组芯片焊盘，并且该组芯片焊盘集中在半导体芯片的第一边缘上。 对应于一个通道的知识产权核心形成在第一半导体芯片部分的边缘上，并且IP核心对应于芯片组集中的边缘。

公开(公告)号：US20160172286A1

公开(公告)日：2016-06-16

申请号：US14746247

申请日：2015-06-22

Applicant: Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

Inventor： Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

IPC: H01L23/498 ,  H05K1/18

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09218 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

Abstract translation: 提供半导体封装，模块基板和具有该半导体封装的半导体封装模块。 半导体封装模块包括在其上表面上设置有多个信号线的模块基板，设置在模块基板上的封装基板，设置在封装基板的一个表面上的半导体芯片，以及设置在多个外部连接端子 在封装衬底的另一个表面上。