CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF
    2.
    发明公开
    CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF 审中-公开
    CRYSTAL设备,而用于生产的封装和工艺

    公开(公告)号:EP2525399A4

    公开(公告)日:2016-11-23

    申请号:EP10856616

    申请日:2010-11-16

    Applicant: ZTE CORP

    Inventor: LV FEI GE HU SONG JIE

    Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

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