公开(公告)号：US20170369747A1

公开(公告)日：2017-12-28

申请号：US15231723

申请日：2016-08-08

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  HONG-PING LIN

IPC: C09J109/06 ,  B32B27/30 ,  B32B27/18 ,  C09J1/00 ,  C09J7/02 ,  H05K1/03 ,  C08L9/06

CPC classification number: C09J109/06 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/102 ,  B32B2405/00 ,  B32B2457/08 ,  C08L9/06 ,  C08L53/02 ,  C08L2201/02 ,  C08L2203/162 ,  C08L2203/206 ,  C08L2207/324 ,  C09J1/00 ,  C09J153/02 ,  C09J2203/326 ,  C09J2205/114 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  C08L9/00 ,  C08K5/541

Abstract: A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

公开(公告)号：US20190055378A1

公开(公告)日：2019-02-21

申请号：US15826615

申请日：2017-11-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  HONG-PING LIN

IPC: C08K7/26 ,  C08K9/06 ,  C04B35/14 ,  C04B35/447 ,  B28B1/30 ,  B28B7/34

Abstract: An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.