Abstract:
The technology concerning improvement of resolution of an acoustic wave sensor having a hemispherical shape or the like is provided. An ultrasonic transducer unit includes an ultrasonic transducer having a plurality of ultrasonic transducer elements, and a probe casing configured to support a plurality of the ultrasonic transducers, and to have a concave portion facing a subject. The plurality of ultrasonic transducer elements is arranged on a same plane facing a center of curvature of the probe casing. The plurality of ultrasonic transducer elements is arranged in a rotationally symmetrical manner about a normal line connecting the center of curvature of the probe casing to a point on a plane of the ultrasonic transducer.
Abstract:
The invention relates to a transducer laminate in which electrical contact is made between electrical conductors (C1, C2) and a transducer layer (TY). The transducer laminate includes two adhesive-coated foils (F1, F2), whose adhesive coatings (AC1, AC2) are arranged to face each other. At a first position (A-A′) along the length of the two electrical conductors (C1, C2) the two electrical conductors (C1, C2) are sandwiched between the adhesive coatings (AC1, AC2) of the two adhesive-coated foils, and the transducer layer (TY) is also sandwiched between the two electrical conductors (C1, C2) such that electrical contact is made with the electrodes (E1, E2) on the transducer layer (TY). At a second position (B-B′) along the length of the two electrical conductors (C1, C2) the two electrical conductors (C1, C2) are sandwiched between the adhesive coatings (AC1, AC2) of the two adhesive-coated foils and there is no transducer layer (TY) sandwiched between the two electrical conductors (C1, C2).
Abstract:
A method of fabricating a film vibration device, including: photoetching a surface of a silicon wafer to form a circular-hole array; etching an aluminum layer on the silicon wafer; etching the silicon wafer to form a through-hole array to obtain a porous silicon wafer; attaching a polyethylene terephthalate (PET) sheet to a side of the porous silicon wafer; ablating the PET sheet to obtain a porous PET film; attaching a polyvinylidene fluoride (PVDF) film to a lower side of the porous silicon wafer; performing vacuumization above the porous silicon wafer, while heating the PVDF film below the porous silicon wafer to create dome micro-structures on the PVDF film; and laminating the porous PET film on each of two sides of the PVDF film to obtain the film vibration device. This application also provides a cleaning device having the film vibration device.
Abstract:
A fingerprint recognition module, a display panel and driving method, and a display device are provided. The fingerprint recognition module includes a first electrode layer including a plurality of first electrodes, and a piezoelectric layer disposed on a side of the first electrode layer. The fingerprint recognition module also includes a second electrode layer disposed on a side of the piezoelectric layer facing away from the first electrode layer. The second electrode layer includes a plurality of second electrodes that are arranged along a first direction, and one second electrode overlaps at least two first electrodes. Moreover, the fingerprint recognition module includes a flexible circuit board bonded and connected to the plurality of second electrodes. In a plane parallel to the first electrode layer, the plurality of second electrodes and the flexible circuit board are arranged along a second direction, and the first direction intersects the second direction.