5.
    实用新型
    失效

    公开(公告)号:JPS5124860U

    公开(公告)日:1976-02-24

    申请号:JP9660174

    申请日:1974-08-12

    METHOD FOR MAKING HYBRID PHOTOMULTIPLIER TUBE WITH SOLID STATE ELEMENT AND TRANSFER ENERGY-SENSITIVE ELECTRON-EMISSIVE SURFACE

    公开(公告)号:GB1358132A

    公开(公告)日:1974-06-26

    申请号:GB4973872

    申请日:1972-10-27

    Applicant: BENDIX CORP

    Abstract: 1358132 Photo-electric detectors BENDIX CORP 27 Oct 1972 [3 Nov 1971] 49738/72 Heading H1D A method for making a hybrid photomultiplier tube containing at least one solid state electron multiplying element comprises forming an energy sensitive electron emissive surface on a transportable substrate 14 in an evacuated processing chamber, connecting the chamber with processed emissive surface to an evacuable hybrid photomultiplier tube envelope 30 containing at least one electron multiplying element, evacuating and baking the envelope, opening a vacuum passage between chamber and envelope, transporting the substrate with the emissive surface into the photomultiplier and sealing therein. The process eliminates introduction of alkali metal vapours into the envelope. Fig. 1 shows processing chamber 10 where metals are reacted with alkali metal vapours from respective generators 13, 12, pump 19, magnetically operated hammer 21 of a metallic slug for fracturing sealed end 17 with scratched groove 23, and debris chamber 24, with shock absorbing spun glass 25. Envelope 30 includes window 32, solid state element 33, support plate 34, latch 35 and leads 36 for mechanical support and electrical contact through the vacuum enclosure. The transportable substrate Fig. 2 (not shown) includes transparent centre (37) (e.g. glass, ceramic or other transparent crystalline substance), with magnetically susceptible band (38), e.g. of iron, KOVAR, or RHODAR (R.T.M.s) or the substrate may be a circular magnetic plate for subsequent transporting. Surface 15 is formed in chamber 10 prior to connection to pump 19 and envelope 30 by connection to pump 41 (Fig. 3, not shown) including oven (43), electric power sources (45) for sources (12), (13) (e.g. resistive heating or RF induction). Fig. 4 (not shown) illustrates latch 35 for fixing the transportable substrate and includes catch (50) on spring (51), magnetic block (52), fixed clips (54) and magnet (22). More than one separate envelope (30) may be connected to a single chamber (10). Evaluation of surface 15 may be effected before final fabrication steps and matching of emissive surfaces and envelopes is discussed. Pulse counting and laser communication uses are instanced.

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