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1.发明申请Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof 审中-公开导电压敏粘合剂，其制造方法和使用公开(公告)号：US20050062024A1
公开(公告)日：2005-03-24
申请号：US10903462
申请日：2004-07-30
Applicant: Michael Bessette , Sankar Paul
Inventor： Michael Bessette , Sankar Paul
CPC classification number: B82Y30/00 , C09J7/22 , C09J7/38 , C09J9/02 , C09J11/04 , C09J2201/602 , C09J2483/006 , H01B1/24 , H01L23/552 , H01L2924/0002 , H01L2924/00
Abstract: An adhesive, comprising a pressure-sensitive adhesive composition; and carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive. Such adhesives are of particular use with gasketing materials.
Abstract translation: 一种粘合剂，其包含压敏粘合剂组合物; 和有效使压敏粘合剂组合物导电的量的碳纳米管。 这种粘合剂特别用于衬垫材料。
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2.发明申请Electrically conductive, flame retardant fillers, method of manufacture, and use thereof 审中-公开导电阻燃填料，其制造方法和用途公开(公告)号：US20050059754A1
公开(公告)日：2005-03-17
申请号：US10903865
申请日：2004-07-30
Applicant: Michael Lunt , Michael Bessette , Sankar Paul
Inventor： Michael Lunt , Michael Bessette , Sankar Paul
Abstract: A conductive, flame retardant composition is formed from a particulate flame retardant coated with a conductive metal. The composition can provide both conductivity and flame retardance to polymeric compositions such as adhesives, foams, and elastomers.
Abstract translation: 导电阻燃组合物由涂覆有导电金属的颗粒状阻燃剂形成。 组合物可以为聚合物组合物例如粘合剂，泡沫和弹性体提供导电性和阻燃性。
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3.发明授权Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith 有权电介质材料，从其形成子组件的方法以及与其形成的子组件公开(公告)号：US08632874B2
公开(公告)日：2014-01-21
申请号：US12813556
申请日：2010-08-23
Applicant: Sankar Paul , Scott D. Kennedy , Dirk M. Baars
Inventor： Sankar Paul , Scott D. Kennedy , Dirk M. Baars
CPC classification number: H05K3/4626 , B32B3/04 , B32B3/08 , B32B3/18 , B32B3/30 , B32B5/08 , B32B5/16 , B32B5/30 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/14 , B32B15/16 , B32B15/20 , B32B25/08 , B32B25/14 , B32B27/08 , B32B27/12 , B32B27/14 , B32B27/20 , B32B27/26 , B32B27/285 , B32B27/302 , B32B27/32 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2260/025 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/14 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2264/12 , B32B2270/00 , B32B2307/202 , B32B2307/204 , B32B2307/30 , B32B2307/302 , B32B2307/3065 , B32B2307/308 , B32B2307/7265 , B32B2457/00 , B32B2457/08 , C08G65/485 , C08K3/013 , C08L9/00 , C08L13/00 , C08L15/00 , C08L19/006 , C08L51/04 , C08L71/12 , C08L71/126 , C08L2666/08 , C08L2666/14 , C09J107/00 , C09J113/00 , C09J171/12 , H05K1/0393 , H05K3/00 , H05K3/462 , H05K3/4641 , H05K3/4676 , H05K2201/0133 , H05K2201/0158 , H05K2201/0355 , H05K2201/10378 , Y10T156/10 , Y10T428/24802 , Y10T428/263 , Y10T428/31544 , Y10T428/31931 , C08L2666/04
Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
Abstract translation: 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。
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4.发明授权Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom 有权具有改进粘结的电路材料，其制造方法和由其形成的制品公开(公告)号：US08257820B2
公开(公告)日：2012-09-04
申请号：US12370806
申请日：2009-02-13
Applicant: Sankar Paul , Dirk M. Baars
Inventor： Sankar Paul , Dirk M. Baars
CPC classification number: H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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Patent Agency Ranking
5.发明申请CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM 有权具有改进粘合剂的电路材料，其制造方法及其形成的制品公开(公告)号：US20110031003A1
公开(公告)日：2011-02-10
申请号：US12937018
申请日：2009-02-13
Applicant: Sankar Paul , Dirk M. Baars
Inventor： Sankar Paul , Dirk M. Baars
CPC classification number: H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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6.发明授权Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom 有权具有改进粘结的电路材料，其制造方法和由其形成的制品公开(公告)号：US08519273B2
公开(公告)日：2013-08-27
申请号：US12937018
申请日：2009-02-13
Applicant: Sankar Paul , Dirk M. Baars
Inventor： Sankar Paul , Dirk M. Baars
IPC: H05K1/00
CPC classification number: H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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7.发明申请CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM 有权具有改进粘合剂的电路材料，其制造方法及其形成的制品公开(公告)号：US20090191387A1
公开(公告)日：2009-07-30
申请号：US12370806
申请日：2009-02-13
Applicant: Sankar Paul , Dirk M. Baars
Inventor： Sankar Paul , Dirk M. Baars
CPC classification number: H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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8.发明申请公开(公告)号：US20100307803A1
公开(公告)日：2010-12-09
申请号：US12813556
申请日：2010-08-23
Applicant: Sankar Paul , Scott D. Kennedy , Dirk M. Baars
Inventor： Sankar Paul , Scott D. Kennedy , Dirk M. Baars
IPC: H05K1/09 , C08L9/00 , C08K3/22 , C08K3/38 , C08K3/28 , C08L53/00 , B32B37/14 , H05K1/00 , H05K1/11
CPC classification number: H05K3/4626 , B32B3/04 , B32B3/08 , B32B3/18 , B32B3/30 , B32B5/08 , B32B5/16 , B32B5/30 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/14 , B32B15/16 , B32B15/20 , B32B25/08 , B32B25/14 , B32B27/08 , B32B27/12 , B32B27/14 , B32B27/20 , B32B27/26 , B32B27/285 , B32B27/302 , B32B27/32 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2260/025 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/14 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2264/12 , B32B2270/00 , B32B2307/202 , B32B2307/204 , B32B2307/30 , B32B2307/302 , B32B2307/3065 , B32B2307/308 , B32B2307/7265 , B32B2457/00 , B32B2457/08 , C08G65/485 , C08K3/013 , C08L9/00 , C08L13/00 , C08L15/00 , C08L19/006 , C08L51/04 , C08L71/12 , C08L71/126 , C08L2666/08 , C08L2666/14 , C09J107/00 , C09J113/00 , C09J171/12 , H05K1/0393 , H05K3/00 , H05K3/462 , H05K3/4641 , H05K3/4676 , H05K2201/0133 , H05K2201/0158 , H05K2201/0355 , H05K2201/10378 , Y10T156/10 , Y10T428/24802 , Y10T428/263 , Y10T428/31544 , Y10T428/31931 , C08L2666/04
Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
Abstract translation: 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。
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9.发明申请Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof 审中-公开具有改善与导电金属的键合的电路板材料及其制造方法公开(公告)号：US20070093035A1
公开(公告)日：2007-04-26
申请号：US11583999
申请日：2006-10-19
Applicant: Robert Daigle , Amit Das , Sankar Paul , Dirk Baars , Allen Horn
Inventor： Robert Daigle , Amit Das , Sankar Paul , Dirk Baars , Allen Horn
CPC classification number: H05K3/38 , H05K3/381 , H05K3/386 , H05K3/389 , H05K2201/0116 , H05K2201/0209 , H05K2201/0355 , H05K2201/2063 , H05K2201/2072
Abstract: Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties.
Abstract translation: 在电介质基板和导电层之间使用粗糙化的电介质层，其允许增加层之间的粘附，而不会导致与粗糙化的导体层相关的导体损耗，以及提高蚀刻精度。 该方法广泛适用于各种电介质基底和导电层结构，并且可以容易地调节以提供期望的粘合水平和其它有利的性质。
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